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參數(shù)資料
| 型號(hào)： | MC68150FN33 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | SPECIALTY MICROPROCESSOR CIRCUIT, PQCC68 |
| 封裝： | PLASTIC, LCC-68 |
| 文件頁(yè)數(shù)： | 33/40頁(yè) |
| 文件大小： | 384K |
| 代理商： | MC68150FN33 |
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MC68150
39
MOTOROLA
High Performance Frequency
Control Products — BR1334
OUTLINE DIMENSIONS
25.02
4.20
2.29
0.33
0.66
0.51
0.64
24.13
1.07
—
2
°
23.12
1.02
25.27
4.57
2.79
0.48
0.81
—
24.28
1.21
1.42
0.50
10
°
23.62
—
0.985
0.165
0.090
0.013
0.026
0.020
0.025
0.950
0.042
—
2
°
0.910
0.040
0.995
0.180
0.110
0.019
0.032
—
0.956
0.048
0.056
0.020
10
°
0.930
—
D
-N-
-L-
-M-
D
Y BRK
W
V
1
68
X
B
U
Z
G1
VIEW D-D
0.010 (0.250)
T L –M S
N S
S
0.007 (0.180)
T L –M S
N S
M
0.007 (0.180)
T L –M S
N S
M
0.007 (0.180)
T L –M S
N S
M
H
K1
K
VIEW S
F
0.007 (0.180)
T L –M S
N S
M
G
C
G1
0.010 (0.250)
T L –M S
N S
S
VIEW S
0.004 (0.100)
SEATING
PLANE
-T-
E
J
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN
MAX
DIM
1.27 BSC
0.050 BSC
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING
PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
INCHES
MILLIMETERS
A
0.007 (0.180)
T L –M S
N S
M
R
0.007 (0.180)
T L –M S
N S
M
Z
FN SUFFIX
PLASTIC PACKAGE
CASE 779-02
ISSUE C
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS
R AND U ARE DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION
OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE GREATER THAN
0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT
CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
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