參數(shù)資料
型號(hào)： MC56F8002MWL
廠商： FREESCALE SEMICONDUCTOR INC
元件分類(lèi)： 微控制器/微處理器
英文描述： 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, PDSO28
封裝： 7.50 X 18 MM, ROHS COMPLIANT, MS-013AE, SOIC-28
文件頁(yè)數(shù)： 75/106頁(yè)
文件大?。?/td> 1215K
代理商： MC56F8002MWL
MC56F8006/MC56F8002 Digital Signal Controller, Rev. 4
Design Considerations
Freescale Semiconductor
70
9
Design Considerations
9.1
Thermal Design Considerations
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RJ x PD)
Eqn. 3
where:
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy estimation of thermal
performance. Unfortunately, there are two values in common usage: the value determined on a single-layer board and the value
obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which
value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a
single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low-power dissipation and the components are well separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal resistance and a
case-to-ambient thermal resistance:
RJA = RJC + RCA
Eqn. 4
where:
RJC is device related and cannot be adjusted. You control the thermal environment to change the case to ambient thermal
resistance, RCA. For instance, you can change the size of the heat sink, the air flow around the device, the interface material,
the mounting arrangement on printed circuit board, or change the thermal dissipation on the printed circuit board surrounding
the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the thermal characterization
parameter (
JT) can be used to determine the junction temperature with a measurement of the temperature at the top center of
the package case using the following equation:
TJ = TT + (JT x PD)
Eqn. 5
where:
The thermal characterization parameter is measured per JESD51–2 specification using a 40-gauge type T thermocouple epoxied
to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the
TA
=
Ambient temperature for the package (oC)
RJ
=
Junction-to-ambient thermal resistance (oC/W)
PD
=
Power dissipation in the package (W)
RJA
=
Package junction-to-ambient thermal resistance (°C/W)
RJC
=
Package junction-to-case thermal resistance (°C/W)
RCA
=
Package case-to-ambient thermal resistance (°C/W)
TT
=
Thermocouple temperature on top of package (oC)
JT
=
Thermal characterization parameter (oC/W)
PD
=
Power dissipation in package (W)
相關(guān)PDF資料
PDF描述
MC56F8006VLC 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, PQFP32
MC56F8006VLF 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, PQFP48
MC56F8006MWL 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, PDSO28
MC56F8006MLF 16-BIT, FLASH, 32 MHz, MICROCONTROLLER, PQFP48
MC56F8323MFB60 0-BIT, 120 MHz, OTHER DSP, PQFP64
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC56F8002VWL 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC DSC 28SOIC 12K Flash RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
MC56F8002VWL 制造商:Freescale Semiconductor 功能描述:IC DSC 16BIT 12KB 32MHZ 3.6V SOIC-28
MC56F8006 制造商:FREESCALE 制造商全稱(chēng):Freescale Semiconductor, Inc 功能描述:Digital Signal Controller
MC56F8006DEMO 功能描述:開(kāi)發(fā)板和工具包 - 其他處理器 MC56F8006 DEMO BOARD RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類(lèi)型:I2C, SPI, USB 工作電源電壓:
MC56F8006DEMO 制造商:Freescale Semiconductor 功能描述:MC56F8006DEMO board w/o USB TAP
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