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參數(shù)資料
| 型號： | MC33298 |
| 廠商： | 飛思卡爾半導體(中國)有限公司 |
| 英文描述： | Eight Output Switch with Serial Peripheral Interface I/O(帶SPI接口的八輸出開關(guān)) |
| 中文描述： | 8個串行外圍接口的I / O（帶的SPI接口的八輸出開關(guān)輸出開關(guān)） |
| 文件頁數(shù)： | 22/28頁 |
| 文件大小： | 642K |
| 代理商： | MC33298 |
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33298
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Go to: www.freescale.com
15, and 16 of the power DIP package are connected directly to
the lead frame flag. The parameter values indicated take into
account adjacent output combinations. The characterization
was conducted over power dissipation levels of 0.7 to 17 W.
The junction-to-ambient temperature thermal resistance was
found to be 37°C/W with a single output active (31°C/W with all
outputs dissipating equal power) and in conjunction with this,
the thermal resistance from junction to PC board (R
junction-board
)
was found to be 27°C/W (board temperature, measure one inch
from device center). Additionally, the thermal resistance from
junction-to-heatsink lead was found to approximate 10°C/W.
Devoting additional PC board metal around the heatsinking
pins improved R
pkg
from 30° to 28° C/W.
The SOP-24 package has pins 5, 6, 7, 8, 17, 18, 19, and 20
of the package connected directly to the lead frame flag.
Characterization was conducted in the same manner as with
the DIP package. The junction-to-ambient temperature
resistance was found to be 40°C/W with a single output active
(34°C/W with all outputs dissipating equal power0 and the
thermal resistance from junction-to-PC board (R
junction-board
) to
be 30°C/W (board temperature, measure one inch from device
center). The junction-to-heatsink lead resistance was found
again to approximate 10°C/W. Devoting additional PC board
metal around the heatsinking pins for this package improved
the R
pkg
from 33° to 31°C/W.
The total power dissipation available is dependent on the
number of outputs enabled at any one time. At 25°C the R
DS(on)
in 450 m
with a coefficient of 6500 ppm/°C. For the junction
temperature to remain below 150°C, the maximum available
power dissipation must decrease as the ambient temperature
increases. Figures 21 and 22 depict the per output limit of
current at ambient temperatures necessary when one, four, or
eight outputs are enable ON. Figure 23 illustrates how the
R
DS(on)
output value is affected by junction temperature.
Figure 20. Thermal Model (Electrical Equivalent)
Junction Temperature Node
V
D
- T
D
(C°)
(Volts represent Die Surface Temperature)
I
PWR
(Steady State or Transient)
(1.0 A = 1.0 W of Device Power Dissipation)
Flag Temperature Node
Ambient Temperature Node
V
= T
(C°)
(1.0 V = 1°C Ambient Temperature)
C
pkg
= C
flag
+ C
PC Board
R
pkg
= R
leads
+R
PC Board
Output 0
Output 1
Output 2
Output 6
Output 7
R
d0
R
d1
R
d2
R
d6
R
d7
C
d0
C
d1
C
d2
C
d6
C
d7
Package
R
dx
(
)*
C
dx
(F)*
R
pkg
(
)*
C
pkg
(F)*
20 Pin Dip
SOP-24L
7.0
7.0
0.002
0.002
30
33
0.2
0.15
*
= °C/W, F = W s/°C, I
PWR
= W, and V
A
= °C
F
Freescale Semiconductor, Inc.
For More Information On This Product,
n
.
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| MC33298DW | 功能描述:IC SWITCH SERIAL OCTAL 24-SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - MOSFET，電橋驅(qū)動器 - 內(nèi)部開關(guān) 系列:- 標準包裝:1,000 系列:- 類型:高端/低端驅(qū)動器 輸入類型:SPI 輸出數(shù):8 導通狀態(tài)電阻:850 毫歐，1.6 歐姆 電流 - 輸出 / 通道:205mA，410mA 電流 - 峰值輸出:500mA，1A 電源電壓:9 V ~ 16 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 供應商設(shè)備封裝:PG-DSO-20-45 包裝:帶卷 (TR) |
| MC33298DWR2 | 功能描述:IC OCTAL SERIAL SWITCH 24-SOIC RoHS:否 類別:集成電路 (IC) >> PMIC - MOSFET，電橋驅(qū)動器 - 內(nèi)部開關(guān) 系列:- 標準包裝:1,000 系列:- 類型:高端/低端驅(qū)動器 輸入類型:SPI 輸出數(shù):8 導通狀態(tài)電阻:850 毫歐，1.6 歐姆 電流 - 輸出 / 通道:205mA，410mA 電流 - 峰值輸出:500mA，1A 電源電壓:9 V ~ 16 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:20-SOIC（0.295"，7.50mm 寬） 供應商設(shè)備封裝:PG-DSO-20-45 包裝:帶卷 (TR) |
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