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參數(shù)資料
| 型號： | MC26LS30DG |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 2/14頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC LINE DRIVER DUAL/QUAD 16-SOIC |
| 產(chǎn)品變化通告： | Product Obsolescence 24/Jan/2011 |
| 標準包裝： | 48 |
| 類型： | 驅動器 |
| 驅動器/接收器數(shù)： | 4/0 |
| 規(guī)程： | RS422，RS423 |
| 電源電壓： | 4.75 V ~ 5.25 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-SOIC（0.154"，3.90mm 寬） |
| 供應商設備封裝： | 16-SOIC |
| 包裝： | 管件 |
| 其它名稱： | MC26LS30DG-ND MC26LS30DGOS |
MC26LS30
http://onsemi.com
10
transients induced onto the drivers’ outputs from the
external cable (from ESD, motor noise, nearby computers,
etc.).
Operating Temperature Range
The maximum ambient operating temperature, listed as
+85
°C, is actually a function of the system use (i.e.,
specifically how many drivers within a package are used)
and at what current levels they are operating. The maximum
power which may be dissipated within the package is
determined by:
PDmax +
TJmax * TA
R
qJA
where RθJA = package thermal resistance which is typically:
120
°C/W for the SOIC (D) package,
TJmax = max. allowable junction temperature (150°C)
TA = ambient air temperature near the IC package.
1) Differential Mode Power Dissipation
For the differential mode, the power dissipated within the
package is calculated from:
PD + [(VCC * VOD)
IO ] (each driver) ) (VCC
IB)
where: VCC = the supply voltage
value of IO
IB
= the internal bias current (Figure 7)
As indicated in the equation, the first term (in brackets) must
be calculated and summed for each of the two drivers, while
the last term is common to the entire package. Note that the
term (VCC VOD) is constant for a given value of IO and does
not vary with VCC. For an application involving the
following conditions:
TA = +85°C, IO = 60 mA (each driver), VCC = 5.25 V, the
suitability of the package types is calculated as follows.
The power dissipated is:
PD + [3.0 V
60 mA
2]
) (5.25 V
18 mA)
PD + 454 mW
The junction temperature calculates to:
TJ + 85°C ) (0.454 W
120
°C W) + 139°C for the
SOIC package.
Since the maximum allowable junction temperature is not
exceeded in any of the above cases, either package can be
used in this application.
2) SingleEnded Mode Power Dissipation
For the singleended mode, the power dissipated within
the package is calculated from:
PD + (IB
)
VCC) ) (IB
*
VEE) )
[(IO
(VCC * VOH)](each driver)
The above equation assumes IO has the same magnitude
for both output states, and makes use of the fact that the
identical. IB+ and IB are obtained from the right half of
given value of IO and does not vary with VCC. For an
application involving the following conditions:
TA = +85°C, IO = 60 mA (each driver), VCC = 5.25 V,
VEE = 5.25 V, the suitability of the package types is
calculated as follows.
The power dissipated is:
PD + 490 mW
PD + (24 mA
5.25 V)
) (*3.0 mA
*5.25 V) )
[ 60 mA
1.45 V
4.0 ]
The junction temperature calculates to:
TJ + 85°C ) (0.490 W
120
°C W) + 144°C for the
SOIC package.
Since the maximum allowable junction temperature is not
exceeded in any of the above cases, either package can be
used in this application.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MC26LS30DG | 制造商:ON Semiconductor 功能描述:RS422/485 Line Driver IC |
| MC26LS30DR2 | 功能描述:RS-422接口集成電路 Dual Diff EIA-422-A RoHS:否 制造商:Texas Instruments 數(shù)據(jù)速率: 工作電源電壓:5 V 電源電流:35 mA 工作溫度范圍: 安裝風格:Through Hole 封裝 / 箱體:PDIP-16 封裝:Tube |
| MC26LS30DR2G | 功能描述:RS-422接口集成電路 Dual Diff EIA-422-A to Quad EIA-423-A RoHS:否 制造商:Texas Instruments 數(shù)據(jù)速率: 工作電源電壓:5 V 電源電流:35 mA 工作溫度范圍: 安裝風格:Through Hole 封裝 / 箱體:PDIP-16 封裝:Tube |
| MC26LS31 | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Quad Line Driver with NAND Enabled Three-State Outputs |
| MC26LS31D | 制造商:Motorola Inc 功能描述: |
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