MC145159–1
MOTOROLA
5
PIN DESCRIPTIONS
INPUT PINS
OSCin, OSCout
Oscillator Input and Oscillator Output (PDIP, SOG –
Pins 2, 3; SSOP – Pins 7, 8)
These pins form an on–chip reference oscillator when
connected to terminals of an external parallel–resonant
crystal. Frequency–setting capacitors of appropriate value
must be connected from OSCin to VSS and OSCout to
VSS. OSCin may also serve as input for an externally–gen-
erated reference signal. This signal will typically be ac
coupled to OSCin, but for larger amplitude signals (standard
CMOS logic levels), dc coupling may also be used. In the
external reference mode, no connection is required to
OSCout.
fin
Frequency Input (PDIP, SOG – Pin 10, SSOP – Pin 15)
Input to the positive edge triggered divide–by–N and di-
vide–by–A counters. fin is typically derived from a dual–
modulus prescaler and is ac coupled. This input has an
inverter biased in the linear region to allow use with ac
coupled signals as low as 500 mV peak–to–peak or direct
coupled signals swinging from VDD to VSS.
DATA
Serial Data Input (PDIP, SOG – Pin 12, SSOP – Pin 17)
Counter and control information is shifted into this input.
The last data bit entered goes into the one–bit control shift
register. A logic 1 allows the reference counter information to
be loaded into its 14–bit latch when ENB goes high. A logic 0
entered as the control bit disables the reference counter
latch. The divide–by–A/divide–by–N counter latch is loaded,
regardless of the contents of the control register, when ENB
goes high. The data entry format is shown in Figure 1.
ENB
Transparent Latch Enable (PDIP, SOG – Pin 13,
SSOP – Pin 18)
A logic high on this input allows data to be entered into the
divide–by–A/divide–by–N latch and, if the control bit is high,
into the reference counter latch. Counter programming is
unaffected when ENB is low. ENB should be kept normally
low and pulsed high to transfer data to the latches.
CLK
Shift Register Clock (PDIP, SOG – Pin 11, SSOP – Pin 16)
A low–to–high transition on this input shifts data from the
serial data input into the shift registers.
COMPONENT PINS
CR
Ramp Capacitor (PDIP, SOG – Pin 15, SSOP – Pin 20)
The capacitor connected from this pin to VSS
′
is charged
linearly, at a rate determined by RR. The voltage on this
capacitor is proportional to the phase difference of the
frequencies present at the internal phase detector inputs. A
polystyrene or mylar capacitor is recommended.
RR
Ramp Current Bias Resistor (PDIP, SOG – Pin 20,
SSOP – Pin 5)
A resistor connected from this pin to VSS
′
determines the
rate at which the ramp capacitor is charged, thereby affecting
the phase detector gain (see Figure 2).
CH
Hold Capacitor (PDIP, SOG – Pin 18, SSOP – Pin 3)
The charge stored on the ramp capacitor is transferred to
the capacitor connected from this pin to either VDD
′
or VSS
′
.
The ratio of CR to CH should be large enough to have no
effect on the phase detector gain (CR > 10 CH). A low–leak-
age capacitor should be used.
RO
Output Bias Current Resistor (PDIP, SOG – Pin 1,
SSOP – Pin 6)
A resistor connected from this pin to VSS
′
biases the output
N–Channel transistor, thereby setting a current sink on the
analog phase detector output. This resistor adjusts the
APDout bias current (see Figure 3).
OUTPUT PINS
APDout
Analog Phase Detector Output (PDIP, SOG – Pin 17,
SSOP – Pin 2)
This output produces a voltage that controls an external
VCO. The voltage range of this output (VDD = + 9 V) is from
below + 0.5 V to + 8 V or more. The source impedance of this
output is the equivalent of a source follower with an exter-
nally variable source resistor. The source resistor depends
upon the output bias current controlled by the output bias
current resistor, RO. The bias current is adjustable from
0.01 mA to 0.5 mA. The output voltage is not more than
1.05 V below the sampled point on the ramp. With a constant
sample of the ramp voltage at 9 V and the hold capacitor of
50 pF, the instantaneous output ripple is about 5 mV peak–
to–peak.
Figure 1. Data Entry Format