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參數(shù)資料
| 型號： | MC10EP131FAR2G |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 3/11頁 |
| 文件大小： | 0K |
| 描述： | IC FLIP FLOP QUAD CLK ECL 32LQFP |
| 標準包裝： | 2,000 |
| 系列： | 10EP |
| 功能： | 設(shè)置（預設(shè)）和復位 |
| 類型： | D 型總線 |
| 輸出類型： | 差分 |
| 元件數(shù)： | 1 |
| 每個元件的位元數(shù)： | 4 |
| 頻率 - 時鐘： | 3GHz |
| 延遲時間 - 傳輸： | 460ps |
| 觸發(fā)器類型： | 正邊沿 |
| 電源電壓： | 3 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-LQFP |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | MC10EP131FAR2GOS |
MC10EP131, MC100EP131
http://onsemi.com
11
PACKAGE DIMENSIONS
QFN32 5*5*1 0.5 P
CASE 488AM01
ISSUE O
SEATING
32 X
K
0.15 C
(A3)
A
A1
D2
b
1
9
16
17
32
2 X
E2
32 X
8
24
32 X
L
32 X
BOTTOM VIEW
EXPOSED PAD
TOP VIEW
SIDE VIEW
D
A
B
E
0.15 C
PIN ONE
LOCATION
0.10 C
0.08 C
C
25
e
A
0.10
B
C
0.05 C
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PLANE
DIM MIN
NOM
MAX
MILLIMETERS
A
0.800 0.900 1.000
A1
0.000 0.025 0.050
A3
0.200 REF
b
0.180 0.250 0.300
D
5.00 BSC
D2
2.950 3.100 3.250
E
5.00 BSC
E2
e
0.500 BSC
K
0.200
L
0.300 0.400 0.500
2.950 3.100 3.250
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.50 PITCH
3.20
0.28
3.20
32 X
28 X
0.63
32 X
5.30
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81357733850
MC10EP131/D
ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC).
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
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