- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄385563 > MC100LVEP111 (ON SEMICONDUCTOR) 2.5V / 3.3V 1:10 Differential ECL/PECL/HSTL Clock Driver(2.5V / 3.3V 1:10 差分 ECL/PECL/HSTL時(shí)鐘驅(qū)動器) PDF資料下載
參數(shù)資料
| 型號： | MC100LVEP111 |
| 廠商： | ON SEMICONDUCTOR |
| 英文描述： | 2.5V / 3.3V 1:10 Differential ECL/PECL/HSTL Clock Driver(2.5V / 3.3V 1:10 差分 ECL/PECL/HSTL時(shí)鐘驅(qū)動器) |
| 中文描述： | 為2.5V / 3.3V的1:10差動ECL / PECL的/ HSTL時(shí)鐘驅(qū)動電壓（2.5V / 3.3V的1:10差分ECL / PECL的/ HSTL時(shí)鐘驅(qū)動器） |
| 文件頁數(shù)： | 9/10頁 |
| 文件大?。?/td> | 154K |
| 代理商： | MC100LVEP111 |
MC100LVEP111
http://onsemi.com
9
PACKAGE DIMENSIONS
éé
éé
éé
DETAIL Y
A
S1
V
B
1
8
9
17
25
32
AE
AE
P
DETAIL Y
BASE
METAL
N
J
D
F
SECTION AE
AE
G
SEATING
PLANE
R
Q
W
K
X
0
G
E
C
H
DETAIL AD
DETAIL AD
A1
B1
V1
4X
S
4X
9
T
Z
U
TU
0.20 (0.008)
Z
AC
TU
0.20 (0.008)
Z
AB
0.10 (0.004) AC
AC
AB
M
8X
T
,
U
,
Z
T
M
0
Z
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DATUM PLANE
AB
IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS
T
,
U
, AND
Z
TO BE
DETERMINED AT DATUM PLANE
AB
.
5. DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE
AC
.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE
AB
.
7. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY
VARY FROM DEPICTION.
DIM
A
A1
MIN
7.000 BSC
3.500 BSC
MAX
MIN
0.276 BSC
0.138 BSC
MAX
INCHES
MILLIMETERS
B
B1
7.000 BSC
3.500 BSC
0.276 BSC
0.138 BSC
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
1.400
0.300
1.350
0.300
0.800 BSC
0.050
0.090
0.450
12 REF
0.090
0.400 BSC
1
0.150
9.000 BSC
4.500 BSC
1.600
0.450
1.450
0.400
0.055
0.012
0.053
0.012
0.031 BSC
0.002
0.004
0.018
12 REF
0.004
0.016 BSC
1
0.006
0.354 BSC
0.177 BSC
0.063
0.018
0.057
0.016
0.150
0.200
0.750
0.006
0.008
0.030
0.160
0.006
5
5
0.250
0.010
V
V1
W
X
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
32 LEAD LQFP
CASE 873A
02
ISSUE C
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MC100LVEP11 | 2.5V / 3.3V ECL 1:2 Differential Fanout Buffer(2.5V / 3.3V ECL 1:2 差分扇出緩沖器) |
| MC100LVEP14 | 2.5V / 3.3V1:5 Differential ECL/PECL/HSTL Clock Driver(2.5V / 3.3V 1:5差分ECL/PECL/HSTL時(shí)鐘驅(qū)動器) |
| MC100LVEP210FARG | 2.5V / 3.3V 1:5 Dual Differential ECL/PECL/HSTL Clock Driver |
| MC100LVEP210FAG | 2.5V / 3.3V 1:5 Dual Differential ECL/PECL/HSTL Clock Driver |
| MC100LVEP34DG | 2.5V / 3.3V ECL ±2, ±4, ±8 Clock Generation Chip |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC100LVEP111FA | 功能描述:時(shí)鐘驅(qū)動器及分配 2.5V/3.3V 1:10 Diff RoHS:否 制造商:Micrel 乘法/除法因子:1:4 輸出類型:Differential 最大輸出頻率:4.2 GHz 電源電壓-最大: 電源電壓-最小:5 V 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-8 封裝:Reel |
| MC100LVEP111FAG | 功能描述:時(shí)鐘驅(qū)動器及分配 2.5V/3.3V 1:10 Diff ECL/PECL/HST Driver RoHS:否 制造商:Micrel 乘法/除法因子:1:4 輸出類型:Differential 最大輸出頻率:4.2 GHz 電源電壓-最大: 電源電壓-最小:5 V 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-8 封裝:Reel |
| MC100LVEP111FAG | 制造商:ON Semiconductor 功能描述:CLOCK GENERATOR / DISTRIBUTOR LOGIC IC |
| MC100LVEP111FAR2 | 功能描述:時(shí)鐘驅(qū)動器及分配 2.5V/3.3V 1:10 Diff RoHS:否 制造商:Micrel 乘法/除法因子:1:4 輸出類型:Differential 最大輸出頻率:4.2 GHz 電源電壓-最大: 電源電壓-最小:5 V 最大工作溫度:+ 85 C 封裝 / 箱體:SOIC-8 封裝:Reel |
| MC100LVEP111FAR2G | 制造商:ON Semiconductor 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。