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參數(shù)資料
| 型號： | MAX9770ETI+ |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 6/22頁 |
| 文件大小： | 0K |
| 描述： | IC AMP AUDIO 1.2W MONO D 28TQFN |
| 標(biāo)準(zhǔn)包裝： | 60 |
| 類型： | D 類 |
| 輸出類型： | 1-通道（單聲道），帶立體聲耳機(jī) |
| 在某負(fù)載時最大輸出功率 x 通道數(shù)量： | 1.2W x 1 @ 8 歐姆; 80mW x 2 @ 16 歐姆 |
| 電源電壓： | 2.5 V ~ 5.5 V |
| 特點(diǎn)： | 消除爆音，輸入多路復(fù)用器，靜音，短路和熱保護(hù)，關(guān)機(jī) |
| 安裝類型： | 表面貼裝 |
| 供應(yīng)商設(shè)備封裝： | 28-TQFN-EP（5x5） |
| 封裝/外殼： | 28-WFQFN 裸露焊盤 |
| 包裝： | 管件 |
Maxim’s DirectDrive architecture uses a charge pump to
create an internal negative supply voltage. This allows
the headphone outputs of the MAX9770 to be biased
about GND, almost doubling dynamic range while oper-
ating from a single supply. With no DC component, there
is no need for the large DC-blocking capacitors. Instead
of two large (220F, typ) tantalum capacitors, the
MAX9770 charge pump requires two small ceramic
capacitors, which conserves board space, reduces cost,
and improves the frequency response of the headphone
driver. See the Output Power vs. Charge-Pump
Capacitance and Load Resistance graph in the
Typical
Operating Characteristics for details of the possible
capacitor sizes. There is a low DC voltage on the driver
outputs due to amplifier offset. However, the offset of the
MAX9770 is typically 5mV, which, when combined with a
32
Ω load, results in less than 160A of DC current flow
to the headphones.
In addition to the cost and size disadvantages of the DC-
blocking capacitors required by conventional head-
phone amplifiers, these capacitors limit the amplifier’s
low-frequency response and can distort the audio signal.
Previous attempts at eliminating the output-coupling
capacitors involved biasing the headphone return
(sleeve) to the DC bias voltage of the headphone
amplifiers. This method raises some issues:
1) When combining a microphone and headphone on a
single connector, the microphone bias scheme typi-
cally requires a 0V reference.
2) The sleeve is typically grounded to the chassis.
Using the midrail biasing approach, the sleeve must
be isolated from system ground, complicating prod-
uct design.
3) During an ESD strike, the driver’s ESD structures are
the only path to system ground. Thus, the driver
must be able to withstand the full ESD strike.
4) When using the headphone jack as a line out to
other equipment, the bias voltage on the sleeve may
conflict with the ground potential from other equip-
ment, resulting in possible damage to the drivers.
MAX9770
1.2W, Low-EMI, Filterless, Mono Class D Amplifier
with Stereo DirectDrive Headphone Amplifiers
14
______________________________________________________________________________________
0
30
20
10
50
40
90
80
70
60
100
0
0.1
0.2
0.4
0.3
0.5
0.6
EFFICIENCY vs. OUTPUT POWER
OUTPUT POWER (W)
EFFICIENCY
(%)
MAX9770
CLASS AB
VDD = 3.3V
f = 1kHz
RL - 8
Ω
Figure 5. MAX9770 Efficiency vs. Class AB Efficiency
MAX9770
800k
Ω
10k
Ω
10k
Ω
VDD
HPS
HPOUTL
HPOUTR
SHUTDOWN
CONTROL
SHDN
Figure 6. HPS Configuration
VIN = 0V
OUT-
OUT+
VOUT+ - VOUT- = 0V
Figure 4. MAX9770 Output with No Signal Applied
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX9770ETI+ | 功能描述:音頻放大器 1.2W Low-EMI Class D Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9770ETI+T | 功能描述:音頻放大器 1.2W Low-EMI Class D Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9770EUI | 制造商:Rochester Electronics LLC 功能描述: |
| MAX9770EUI+ | 功能描述:音頻放大器 1.2W Low-EMI Class D Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9770EUI+T | 功能描述:音頻放大器 1.2W Low-EMI Class D Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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