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Maxim Integrated Products 2
MAX9257A/MAX9258A
Fully Programmable Serializer/Deserializer
with UART/I2C Control Channel
VCC_ to GND........................................................-0.5V to +4.0V
Any Ground to Any Ground .................................-0.5V to +0.5V
SDI+, SDI-, SDO+, SDO- to GND ........................-0.5V to +4.0V
SDO+, SDO- Short Circuit to GND or VCCLVDS .......Continuous
DIN[0:15], GPIO[0:9], PCLK_IN, HSYNC_IN, VSYNC_IN,
SCL/TX, SDA/RX, REM to GND......... -0.5V to (VCCIO + 0.5V)
DOUT[0:15], PCLK_OUT, CCEN, HSYNC_OUT,
VSYNC_OUT, RX, LOCK, TX, PD,
ERROR to GND ..............................-0.5V to (VCCOUT + 0.5V)
Continuous Power Dissipation (TA = +70NC)
40-Lead TQFN
Multilayer PCB (derate 35.7mW/NC above +70NC) ...2857mW
48-Lead LQFP
Multilayer PCB (derate 21.7mW/NC above +70NC) ...1739mW
ESD Protection
Human Body Model (RD = 1.5kI, CS = 100pF)
All Pins to GND ............................................................Q3kV
IEC 61000-4-2 (RD = 330I, CS = 150pF)
Contact Discharge
(SDI+, SDI-, SDO+, SDO-) to GND..............................Q8kV
Air Discharge
(SDI+, SDI-, SDO+, SDO-) to GND............................Q20kV
ISO 10605 (RD = 2kI, CS = 330pF)
Contact Discharge
(SDI+, SDI-, SDO+, SDO-) to GND............................Q10kV
Air Discharge
(SDI+, SDI-, SDO+, SDO-) to GND............................Q30kV
Machine Model (RD = 0I, CS = 200pF)
All Pins to GND ......................................................... Q200V
Storage Temperature Range............................ -65NC to +150NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Junction-to-Ambient Thermal Resistance (
qJA)
40-Pin TQFN ................................................................28NC/W
48-Pin LQFP ................................................................46NC/W
Junction-to-Case Thermal Resistance (
qJC)
40-Pin TQFN ...............................................................1.7NC/W
48-Pin LQFP ................................................................10NC/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
MAX9257A DC ELECTRICAL CHARACTERISTICS
(VCC_ = +3.0V to +3.6V, VCCIO = +1.71V to +3.6V, RL = 50I Q1%, TA = -40NC to +105NC, unless otherwise noted. Typical values are
at VCC_ = +3.3V, TA = +25NC.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SINGLE-ENDED INPUTS
High-Level Input Voltage
VIH
VCCIO = +1.71V to +3V
0.65 x
VCCIO
VCCIO +
0.3
V
VCCIO = +3V to +3.6V
2
VCCIO +
0.3
REM input
2
VCC +
0.3
Low-Level Input Voltage
VIL
VCCIO = +1.71V to +3V
0
0.3 x
VCCIO
V
VCCIO = +3V to +3.6V
0
0.8
REM input
0
0.8