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MAX9247
27-Bit, 2.5MHz-to-42MHz
DC-Balanced LVDS Serializer
2
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ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(VCC_ = +3.0V to +3.6V, RL = 100 ±1%, PWRDWN = high, PRE = low, TA = -40°C to +105°C, unless otherwise noted. Typical
values are at VCC_ = +3.3V, TA = +25°C.) (Notes 1, 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC_ to _GND........................................................-0.5V to +4.0V
Any Ground to Any Ground...................................-0.5V to +0.5V
OUT+, OUT-, CMF to LVDSGND...........................-0.5V to +4.0V
OUT+, OUT- Short Circuit to LVDSGND
or VCCLVDS.............................................................Continuous
OUT+, OUT- Short Through 0.125F (or smaller),
25V Series Capacitor..........................................-0.5V to +16V
RGB_IN[17:0], CNTL_IN[8:0], DE_IN,
RNG0, RNG1, PRE, PCLK_IN,
PWRDWN to GND ...............................-0.5V to (VCCIN + 0.5V)
Continuous Power Dissipation (TA = +70°C)
48-Lead LQFP (derate 20.8mW/°C above +70°C)....1666.7mW
ESD Protection
Machine Model (RD = 0, CS = 200pF)
All Pins to GND ..............................................................±200V
Human Body Model (RD = 1.5k, CS = 100pF)
All Pins to GND ................................................................±3kV
ISO 10605 (RD = 2k, CS = 330pF)
Contact Discharge (OUT+, OUT-) to LVDSGND ...........±10kV
Air-Gap Discharge (OUT+, OUT-) to LVDSGND ...........±30kV
IEC 61000-4-2 (RD = 330, CS = 150pF)
Contact Discharge (OUT+, OUT-) to LVDSGND ...........±10kV
Air-Gap Discharge (OUT+, OUT-) to LVDSGND ...........±15kV
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s)..................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SINGLE-ENDED INPUTS (RGB_IN[17:0], CNTL_IN[8:0], DE_IN, PCLK_IN,
PWRDWN, RNG_, PRE)
VCCIN = 1.71V to < 3V (Note 3)
0.65 x VCCIN
VCCIN + 0.3
High-Level Input Voltage
VIH
VCCIN = 3.0V to 3.6V
2
0.3 + VCCIN
V
VCCIN = 1.71V to < 3V (Note 3)
-0.3
0.3 x VCCIN
Low-Level Input Voltage
VIL
VCCIN = 3.0V to 3.6V
-0.3
+0.8
V
VIN = -0.3V to 0V
(MAX9247ECM),
VIN = -0.15V to 0V
(MAX9247GCM)
-100
+20
Input Current
IIN
VCCIN = 1.71V
to 3.6V,
PWRDWN =
high or low
VIN = 0V to (VCCIN + 0.3V)
-20
+20
A
Input Clamp Voltage
VCL
ICL = -18mA
-1.5
V
LVDS OUTPUTS (OUT+, OUT-)
Differential Output Voltage
VOD
Figure 1
250
335
450
mV
Change in VOD Between
Complementary Output States
VOD
Figure 1
20
mV
Common-Mode Voltage
VOS
Figure 1
1.125
1.29
1.475
V
Change in VOS Between
Complementary Output States
VOS
Figure 1
20
mV
Output Short-Circuit Current
IOS
VOUT+ or VOUT- = 0V or 3.6V
-15
±8
+15
mA
Magnitude of Differential
Output Short-Circuit Current
IOSD
VOD = 0V
5.5
15
mA
VOUT+ = 0V,
VOUT- = 3.6V
Output High-Impedance
Current
IOZ
PWRDWN = low
or VCC_ = 0V
VOUT+ = 3.6V,
VOUT- = 0V
-1
+1
A