參數(shù)資料
型號(hào): MAX5889EVKIT#
廠商: Maxim Integrated Products
文件頁數(shù): 9/16頁
文件大?。?/td> 0K
描述: KIT EVALUATION FOR MAX5889
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 1
DAC 的數(shù)量: 1
位數(shù): 12
采樣率(每秒): 600M
數(shù)據(jù)接口: 并聯(lián)
設(shè)置時(shí)間: 11ns
DAC 型: 電流
工作溫度: -40°C ~ 85°C
已供物品:
已用 IC / 零件: MAX5889
MAX5889
12-Bit, 600Msps, High-Dynamic-Performance
DAC with LVDS Inputs
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(AVDD3.3 = DVDD3.3 = AVCLK = 3.3V, AVDD1.8 = DVDD1.8 = 1.8V, external reference VREFIO = 1.2V, output load 50 double-terminat-
ed, transformer-coupled output, IOUT = 20mA, TA = -40°C to +85°C, unless otherwise noted. Specifications at TA ≥ +25°C are guar-
anteed by production testing. Specifications at TA < +25°C are guaranteed by design and characterization. Typical values are at TA
= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD1.8, DVDD1.8 to AGND, DGND, DACREF,
and CGND.......................................................-0.3V to +2.16V
AVDD3.3, DVDD3.3, AVCLK to AGND, DGND,
DACREF, and CGND.........................................-0.3V to +3.9V
REFIO, FSADJ to AGND, DACREF,
DGND, and CGND ..........................-0.3V to (AVDD3.3 + 0.3V)
OUTP, OUTN to AGND, DGND, DACREF,
and CGND .......................................-1.2V to (AVDD3.3 + 0.3V)
CLKP, CLKN to AGND, DGND, DACREF,
and CGND..........................................-0.3V to (AVCLK + 0.3V)
PD to AGND, DGND, DACREF,
and CGND.......................................-0.3V to (DVDD3.3 + 0.3V)
Digital Data Inputs (D0N–D11N, D0P–D11P) to AGND,
DGND, DACREF, and CGND ..........-0.3V to (DVDD1.8 + 0.3V)
Continuous Power Dissipation (TA = +70°C) (Note 1)
68-Pin QFN-EP (derate 28.6mW/°C above +70°C)....3333mW
Thermal Resistance θJA (Note 1) ....................................24°C/W
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................-60°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC PERFORMANCE
Resolution
12
Bits
Integral Nonlinearity
INL
Measured differentially
±0.25
LSB
Differential Nonlinearity
DNL
Measured differentially
±0.15
LSB
Offset Error
OS
-0.02
0.001
+0.02
%FS
Full-Scale Gain Error
GEFS
External reference
-4
±1+4
%FS
Internal reference
±130
Gain-Drift Tempco
External reference
±100
ppm/
°C
Full-Scale Output Current
IOUT
220
mA
Output Compliance
Single-ended
-1.0
+1.1
V
Output Resistance
ROUT
1M
Output Capacitance
COUT
5pF
Output Leakage Current
PD = high, power-down mode
±1A
DYNAMIC PERFORMANCE
Maximum DAC Update Rate
600
Msps
Minimum DAC Update Rate
1
Msps
fOUT = 36MHz,
AFULL-SCALE = -3.5dBm
-157
Noise Spectral Density
N
fCLK = 500MHz,
-12dBFS, 20MHz
offset from the
carrier
fOUT = 151MHz,
AFULL-SCALE = -6.4dBm
-152
dBFS/Hz
Note 1: Thermal resistance based on a multilayer board with 4 x 4 via array in exposed paddle area.
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