參數(shù)資料
型號(hào)： MAX5856AECM+TD
廠商： Maxim Integrated Products
文件頁(yè)數(shù)： 14/23頁(yè)
文件大?。?/td> 0K
描述： IC DAC 8BIT DUAL 300MSPS 48-TQFP
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 2,000
設(shè)置時(shí)間： 11ns
位數(shù)： 8
數(shù)據(jù)接口： 并聯(lián)
轉(zhuǎn)換器數(shù)目： 2
電壓電源： 單電源
功率耗散（最大）： 792mW
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 48-TQFP 裸露焊盤
供應(yīng)商設(shè)備封裝： 48-TQFP 裸露焊盤（7x7）
包裝： 帶卷 (TR)
輸出數(shù)目和類型： 2 電流，單極
采樣率（每秒）： 300M
Differential DC-Coupled Configuration
Figure 9 shows the MAX5856A output operating in differ-
ential DC-coupled mode. This configuration can be used
in communication systems employing analog quadrature
upconverters and requiring a baseband sampling, dual-
channel, high-speed DAC for I/Q synthesis. In these
applications, information bandwidth can extend from
10MHz down to several hundred kilohertz. DC-coupling
is desirable in order to eliminate long discharge time
constants that are problematic with large, expensive
coupling capacitors. Analog quadrature upconverters
have a DC common-mode input requirement of typically
0.7V to 1.0V. The MAX5856A differential I/Q outputs can
maintain the desired full-scale signal level at the required
0.7V to 1.0V DC common-mode voltage when powered
from a single 2.85V (±5%) supply. The MAX5856A meets
this low-power requirement with minimal reduction in
dynamic range while eliminating the need for level-shift-
ing resistor networks.
Power Supplies, Bypassing,
Decoupling, and Layout
Grounding and power-supply decoupling strongly influ-
ence the MAX5856A performance. Unwanted digital
crosstalk can couple through the input, reference,
power-supply, and ground connections, which can
affect dynamic specifications, like signal-to-noise ratio
or spurious-free dynamic range. In addition, electro-
magnetic interference (EMI) can either couple into or
be generated by the MAX5856A. Observe the ground-
ing and power-supply decoupling guidelines for high-
speed, high-frequency applications. Follow the
power-supply and filter configuration to achieve opti-
mum dynamic performance.
Use of a multilayer printed circuit (PC) board with sepa-
rate ground and power-supply planes is recommend-
ed. Run high-speed signals on lines directly above the
ground plane. The MAX5856A has separate analog
and digital ground buses (AGND, PGND, and DGND,
respectively). Provide separate analog, digital, and
clock ground sections on the PC board with only one
point connecting the three planes. The ground connec-
tion points should be located underneath the device
and connected to the exposed paddle. Run digital sig-
nals above the digital ground plane and analog/clock
signals above the analog/clock ground plane. Digital
signals should be kept away from sensitive analog,
clock, and reference inputs. Keep digital signal paths
short and metal trace lengths matched to avoid propa-
gation delay and data skew mismatch.
The MAX5856A includes three separate power-supply
inputs: analog (AVDD), digital (DVDD), and clock
(PVDD). Use a single linear regulator power source to
branch out to three separate power-supply lines (AVDD,
DVDD, PVDD) and returns (AGND, DGND, PGND). Filter
each power-supply line to the respective return line
using LC filters comprising ferrite beads and 10F
capacitors. Filter each supply input locally with 0.1F
ceramic capacitors to the respective return lines.
Note: To maintain the dynamic performance of the
Electrical Characteristics, ensure the voltage difference
between DVDD, AVDD, and PVDD does not exceed
150mV.
Thermal Characteristics and
Packaging
Thermal Resistance
48-lead TQFP-EP:
θJA = 27.6°C/W
Keep the device junction temperature below +125°C to
meet specified electrical performance. Lower the
power-supply voltage to maintain specified perfor-
mance when the DAC update rate approaches
300Msps and the ambient temperature equals +85°C.
MAX5856A
Dual 8-Bit, 300Msps DAC with 4x/2x/1x
Interpolation Filters and PLL
______________________________________________________________________________________
21
1/2 MAX5856A
OUTPA
OUTNA
50
DA0–DA7
8
1/2 MAX5856A
OUTPB
OUTNB
50
DB0–DB7
8
AVDD DVDD PVDD
AGND DGND PGND
Figure 9. Application with DC-Coupled Differential Outputs
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參數(shù)描述
MAX5858AECM 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
MAX5858AECM+D 功能描述:數(shù)模轉(zhuǎn)換器- DAC 10-Bit 2Ch 300Msps DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
MAX5858AECM+TD 功能描述:數(shù)模轉(zhuǎn)換器- DAC 10-Bit 2Ch 300Msps DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
MAX5858AECM-D 功能描述:數(shù)模轉(zhuǎn)換器- DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
MAX5858AECM-TD 功能描述:數(shù)模轉(zhuǎn)換器- DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
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