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MAX144/MAX145
+2.7V, Low-Power, 2-Channel, 108ksps,
Serial 12-Bit ADCs in 8-Pin MAX
2
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ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = +2.7V to +5.25V, VREF = 2.5V, 0.1F capacitor at REF, fSCLK = 2.17MHz, 16 clocks/conversion cycle (108ksps),
CH- = GND for MAX145, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD to GND ..............................................................-0.3V to +6V
CH0, CH1 (CH+, CH-) to GND ................. -0.3V to (VDD + 0.3V)
REF to GND .............................................. -0.3V to (VDD + 0.3V)
Digital Inputs to GND. ............................................. -0.3V to +6V
DOUT to GND............................................ -0.3V to (VDD + 0.3V)
DOUT Sink Current ........................................................... 25mA
Continuous Power Dissipation (TA = +70°C)
MAX (derate 4.1mW/°C above +70°C) .................... 330mW
Plastic DIP (derate 9.09mW/°C above +70°C) ............727mW
CERDIP (derate 8.00mW/°C above +70°C) . .............. 640mW
Operating Temperature Ranges (TA)
MAX144/MAX145_C_A .......................................0°C to +70°C
MAX144/MAX145_E_A. ...................................-40°C to +85°C
MAX144/MAX145_M_A ................................ -55°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
MAX14_A
MAX14_B
No missing codes over temperature
CONDITIONS
LSB
±0.5
INL
Relative Accuracy (Note 2)
Bits
12
RES
Resolution
±1
LSB
±0.75
DNL
Differential Nonlinearity
UNITS
MIN
TYP
MAX
SYMBOL
PARAMETER
ppm/°C
±0.8
Gain Temperature Coefficient
LSB
±3
LSB
±3
Offset Error
Gain Error
LSB
±0.05
Channel-to-Channel Offset
Matching
LSB
±0.05
Channel-to-Channel Gain
Matching
-3dB rolloff
fIN = 65kHz, VIN = 2.5Vp-p (Note 4)
External clock, fSCLK = 2.17MHz,
16 clocks/conversion cycle
MHz
1.0
Full-Power Bandwidth
MHz
2.25
dB
-85
Channel-to-Channel Crosstalk
Small-Signal Bandwidth
s
7.4
tCONV
Conversion Time (Note 5)
Total Harmonic Distortion
(including 5th-order harmonic)
dB
70
SINAD
Signal-to-Noise Plus
Distortion Ratio
dB
-80
THD
dB
80
SFDR
Spurious-Free Dynamic Range
Internal clock mode, for data transfer only
External clock mode
Internal clock
05
MHz
0.1
2.17
fSCLK
ps
<50
Aperture Jitter
Serial Clock Frequency
57
s
2.5
tACQ
T/H Acquisition Time
ns
25
Aperture Delay
DC ACCURACY (Note 1)
DYNAMIC SPECIFICATIONS (fIN(sine-wave) = 10kHz, VIN = 2.5Vp-p, 108ksps, fSCLK = 2.17MHz, CH- = GND for MAX145)
CONVERSION RATE
(Note 3)