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MAT03
–3–
REV. B
MAT 03N
Limits
Parameter
Symbol
Conditions
Units
Breakdown Voltage
Offset Voltage
BV
CEO
V
OS
36
200
200
80
60
6
200
200
75
75
0.75
0.1
V min
μ
V max
μ
V max
min
min
% max
μ
V max
μ
V max
μ
V max
μ
V max
max
V max
I
C
= 100
μ
A, V
CB
= 0 V
10
μ
A
≤
I
C
≤
1 mA
I
C
= 1 mA, V
CB
= 0 V, –36 V
I
C
= 10
μ
A, V
CB
= 0 V, –36 V
I
C
= 100
μ
A, V
CB
= 0 V
V
CB1
= 0 V, I
C
= 100
μ
A
V
CB2
= –36 V
V
CB
= 0
I
C1
= 10
μ
A, I
C2
= 1 mA
10
μ
A
≤
I
C
≤
1 mA
I
C
= 1 mA, I
B
= 100
μ
A
Current Gain
h
FE
Current Gain Match
Offset Voltage Change vs. V
CB
h
FE
V
OS
/
V
CB
Offset Voltage Change
vs. Collector Current
Bulk Resistance
Collector Saturation Voltage
V
OS
/
I
C
r
BE
V
CE (SAT )
NOT E:
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
WAFER TEST LIMTS
(at 25
8
C, unless otherwse noted.)
DICE CHARACT E RIST ICS
SUBSTRATE CAN BE
CONNECTED TO V– OR
FLOATED
1. COLLECTOR (1 )
2. BASE (1 )
3. EMITTER (1 )
4. COLLECTOR (2)
5. BASE (2)
6. EMITTER (2 )
ABSOLUT E MAX IMUM RAT INGS
1
Collector-Base Voltage (BV
CBO
) . . . . . . . . . . . . . . . . . . . .36 V
Collector-Emitter Voltage (BV
CEO
) . . . . . . . . . . . . . . . . . .36 V
Collector-Collector Voltage (BV
CC
) . . . . . . . . . . . . . . . . . .36 V
Emitter-Emitter Voltage (BV
EE
) . . . . . . . . . . . . . . . . . . . . .36 V
Collector Current (I
C
) . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Emitter Current (I
E
) . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
T otal Power Dissipation
Ambient T emperature
≤
70
°
C
2
. . . . . . . . . . . . . . . .500 mW
Operating T emperature Range
MAT 03A . . . . . . . . . . . . . . . . . . . . . . . . . .–55
°
C to +125
°
C
MAT 03E/F . . . . . . . . . . . . . . . . . . . . . . . . .–40
°
C to +85
°
C
Operating Junction T emperature . . . . . . . . . .–55
°
C to +150
°
C
Storage T emperature . . . . . . . . . . . . . . . . . . .–65
°
C to +150
°
C
Lead T emperature (Soldering, 60 sec) . . . . . . . . . . . . . +300
°
C
Junction T emperature . . . . . . . . . . . . . . . . . .–65
°
C to +150
°
C
NOT ES
1
Absolute maximum ratings apply to both DICE and packaged devices.
2
Rating applies to T O-78 not using a heat sink, and LCC; devices in free air only. For
T O-78, derate linearly at 6.3 mW/
°
C above 70
°
C ambient temperature; for LCC,
derate at 7.8 mW/
°
C.
ORDE RING GUIDE
1
V
OS
max
(T
A
= +25
8
C)
T emperature
Range
Package
Option
Model
MAT 03AH
2
MAT 03EH
MAT 03FH
100
μ
V
100
μ
V
200
μ
V
–55
°
C to +125
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
T O-78
T O-78
T O-78
NOT ES
1
Burn-in is available on industrial temperature range parts.
2
For devices processed in total compliance to MIL-ST D-883, add/883 after part
number. Consult factory for 883 data sheet.
WARNING!
ESD SENSITIVE DEVICE
C AUT ION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the MAT 03 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. T herefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.