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參數(shù)資料
| 型號： | MADP-064908-131000 |
| 元件分類： | PIN二極管 |
| 英文描述： | SILICON, PIN DIODE |
| 封裝： | ODS-1310, 6 PIN |
| 文件頁數(shù)： | 7/7頁 |
| 文件大?。?/td> | 95K |
| 代理商： | MADP-064908-131000 |
Surface Mount Monolithic Integrated PIN Diode Chip
Unconnected Double Tee
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
North America Tel: 800.366.2266 / Fax: 978.366.2266
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
MADP-064908-131000
SurmountTMPINChip V2
Assembly Guidelines
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and
skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual
components. Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder attachment onto hard and soft substrates. Conductive silver epoxy may also
be used for lower Incident power applications (<1W Average Power). The epoxy should be approximately 1-2mils
thick and cured at approximately 90°C to 150°C per the manufacturer’s schedule.
When soldering these devices on to a hard substrate, hot gas die bonding is preferred. We recommend utilizing
a vacuum tip and force of 60 to 100 grams be applied to the top surface of the device. Position the die so that its
mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the
circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of
the die. The solder connections to the pads must not be made one at a time. Doing so would create un-equal
heat flow and thermal stress to the chip. Solder reflow should not be performed by causing heat to flow through
the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually
inspected through the die to ensure proper solder flow after attachment is complete.
Typical solder re-flow profiles are provided in Application Note 538 “Surface Mounting Instructions“ located
on the MA-COM website at www.macom.com
Ordering Information
Part Number
Packaging
MADP-064908-131000
Die in Gel Pack
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