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參數(shù)資料
| 型號(hào)： | MADP-000235-10720T |
| 元件分類： | PIN二極管 |
| 英文描述： | SILICON, PIN DIODE |
| 封裝： | ROHS COMPLIANT, HERMETIC SEALED, CERAMIC, CASE 1072, 2 PIN |
| 文件頁(yè)數(shù)： | 1/3頁(yè) |
| 文件大?。?/td> | 151K |
| 代理商： | MADP-000235-10720T |
North America Tel: 800.366.2266 / Fax: 978.366.2266
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
Non-Magnetic MELF PIN Diode
RoHS Compliant
MADP-000235-10720T
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
1. Exceeding these limits may cause permanent damage to
the device.
2. Values will re-rate over temperature.
Parameter
Absolute Maximum
Reverse Voltage
-35 V
Forward Current
100mA
Operating Temperature
-55°C to +150°C
Storage Temperature
-55°C to +175°C
Mounting Temperature
+260°C for 30 seconds
Absolute Maximum Ratings1,2,3 @ 25°C
Features
Non-Magnetic Package Suitable for MRI
Applications
Rectangular MELF SMQ Ceramic Package
Hermetically Sealed
Description
The MADP-000235-10720T is a surface mountable PIN
diode in a non-magnetic Metal Electrode Leadless Faced
(MELF) package. MADP-000235-10720T incorporates
M/A-COM’s time proven HIPAX technology to produce a
low inductance ceramic package with no ribbons or wires.
The package utilizes M/A-COM’s unique non- magnetic
plating process that provides for a hermetically sealed
package with extremely low permeability. Incorporated in
the package is a passivated PIN diode chip that is full
face bonded on both the cathode and anode to maximize
the surface contact area for lower electrical and thermal
resistance.
The
chip
and
package
have
been
comprehensively characterized both electrically and
mechanically to ensure repeatable and predictable
performance.
Application
The MADP-000235-10720T is designed for circuit
protection and tuning of RF coil designs in MRI
applications. When connected in an anti-parallel
configuration these PIN diodes provide protection from
long RF pulses and spikes.
MELF Internal Construction
Designed for Automated Assembly
This SMQ PIN diode has been designed for high
volume tape and reel assembly. The rectangular
package design provides for highly efficient automatic
pick and place assembly techniques. The parallel flat
surfaces are suitable for key jaw or vacuum pickup
techniques. All solderable surfaces are tin plated and
compatible with most reflow and vapor phase soldering
methods.
RoHS
The MADP-000235-10720T is fully RoHS compliant
meaning it contains less than the maximum allowable
concentration of 0.1% by weight in homogenous
materials for lead, hex chrome, mercury, PBB, PBDE,
and 0.01% of cadmium
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