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參數(shù)資料
| 型號(hào)： | MAC7141 |
| 廠商： | Motorola, Inc. |
| 英文描述： | MAC7100 Microcontroller Family Hardware Specifications |
| 中文描述： | MAC7100微控制器系列硬件規(guī)格 |
| 文件頁數(shù)： | 44/48頁 |
| 文件大?。?/td> | 1514K |
| 代理商： | MAC7141 |
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44
MAC7100 Microcontroller Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
Mechanical Information
5.4
208-Pin MAP BGA Package
Figure 23. 208-Pin MAP BGA Mechanical Dimensions (Case No. 1159A-01)
K
M
M
E
D
0.2
4X
X
LASER MARK FOR PIN A1
IDENTIFICATION IN THIS AREA
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
15X e
X
S
0.3
M
Y
X
Z
0.1
M
Z
208X
b
3
METALIZED MARK FOR PIN A1
IDENTIFICATION IN THIS AREA
15X e
S
VIEW M M
VIEW K
(ROTATED 90 CLOCKWISE)
0.2 Z
5
0.2
208X
Z
Z
4
A
A1
A2
DIM
A
A1
A2
b
D
E
e
S
MIN
---
0.40
1.00
0.50
17.00 BSC
17.00 BSC
1.00 BSC
0.50 BSC
MAX
2.00
0.60
1.30
0.70
MILLIMETERS
NOTES:
1.
2.
3.
4.
5.
ALL DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
PARALLELISM MEASEMENT SHALL EXCLUDE ANY
EFFECT OF MARK ON TOP SURFACE OF PACKAGE.
F
Freescale Semiconductor, Inc.
n
.
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