參數(shù)資料
型號(hào)： MAC7131MPV
廠商： Motorola, Inc.
英文描述： MAC7100 Microcontroller Family Hardware Specifications
中文描述： MAC7100微控制器系列硬件規(guī)格
文件頁(yè)數(shù)： 7/48頁(yè)
文件大?。?/td> 1514K
代理商： MAC7131MPV
MOTOROLA
MAC7100 Microcontroller Family Hardware Specifications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
For More Information On This Product,
Go to: www.freescale.com
7
Electrical Characteristics
3.5.1
Power Dissipation Simulation Details
Comments:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board at the center lead. For fused lead packages, the adjacent lead is used.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and junction temperature per JEDEC
JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Table 7. Thermal Resistance for 100 lead 14x14 mm LQFP, 0.5 mm Pitch
1
1
100 LQFP, Case Outline: 983–02
Table 8. Thermal Resistance for 112 lead 20x20 mm LQFP, 0.65 mm Pitch
1
Rating
Value
44
34
37
29
18
7
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Comments
1, 2
1, 3
1, 3
1, 3
4
5
6
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
R
θ
JA
R
θ
JMA
R
θ
JMA
R
θ
JMA
R
θ
JB
R
θ
JC
Ψ
JT
Natural Convection
1
112 LQFP, Case Outline: 987–01
Table 9. Thermal Resistance for 144 lead 20x20 mm LQFP, 0.5 mm Pitch
1
Rating
Value
42
34
35
30
22
7
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Comments
1, 2
1, 3
1, 3
1, 3
4
5
6
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
R
θ
JA
R
θ
JMA
R
θ
JMA
R
θ
JMA
R
θ
JB
R
θ
JC
Ψ
JT
Natural Convection
1
144 LQFP, Case Outline: 918–03
Table 10. Thermal Resistance for 208 lead 17x17 mm MAP, 1.0 mm Pitch
1
Rating
Value
42
34
35
30
22
7
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Comments
1, 2
1, 3
1, 3
1, 3
4
5
6
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
R
θ
JA
R
θ
JMA
R
θ
JMA
R
θ
JMA
R
θ
JB
R
θ
JC
Ψ
JT
Natural Convection
1
208 MAP BGA, Case Outline: 1159A-01
Rating
Value
46
29
38
26
19
7
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Comments
1, 2
1, 3
1, 3
1, 3
4
5
6
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
R
θ
JA
R
θ
JMA
R
θ
JMA
R
θ
JMA
R
θ
JB
R
θ
JC
Ψ
JT
Natural Convection
F
Freescale Semiconductor, Inc.
n
.
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