參數(shù)資料
型號: MAAPGM0070-DIE
英文描述: Amplifier, Power, 1.9W 10.0-13.25 GHz
中文描述: 放大器,電源,1.9W 10.0-13.25千兆赫
文件頁數(shù): 7/8頁
文件大小: 426K
代理商: MAAPGM0070-DIE
Amplifier, Power, 1.9W
10.0-13.25 GHz
MAAPGM0070-DIE
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
North America
Tel: 800.366.2266 / Fax: 978.366.2266
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com
for additional data sheets and product information.
Rev B
Preliminary Datasheet
7
Pad
Size (
μ
m)
RF In and Out
100 x 200
DC Drain Supply Voltage VDD
200 x 100
DC Gate Supply Voltage VGG
150 x 150
Size (mils)
4 x 8
8 x 4
6 x 6
Bond Pad Dimensions
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Mechanical Information
Chip Size: 3.000 x 3.150 x 0.075 mm
(
118 x 124 x 3 mils)
Figure 23. Die Layout
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