- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄359125 > MA4SW424B-1 Monolithic SP4T PIN Diode Switch With Integrated Bias Network PDF資料下載
參數(shù)資料
| 型號： | MA4SW424B-1 |
| 英文描述： | Monolithic SP4T PIN Diode Switch With Integrated Bias Network |
| 中文描述： | 單片SP4T PIN二極管開關(guān)與集成偏置網(wǎng)絡(luò) |
| 文件頁數(shù)： | 3/6頁 |
| 文件大小： | 651K |
| 代理商： | MA4SW424B-1 |
Monolithic SP4T PIN Diode Switch with Integrated Bias Network
MA4SW424B-1
V 1.00
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
n
North America:
Tel. (800) 366-2266
n
Asia/Pacific:
Tel.+81-44-844-8296, Fax +81-44-844-8298
n
Europe:
Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
3
Mounting
These chips have TiPtAu back metal. They can be die
mounted with a gold-tin eutectic solder preform or electrically
conductive epoxy. Mounting surface must be clean and flat.
Eutectic Die Attachment
An 80/20 Gold-Tin eutectic solder preform is recommended
with a work surface temperature of 255 °C and a tool tip
temperature of 265 °C. When hot gas is applied, the tool tip
temperature should be 290 °C. The chip should not be exposed
to temperatures greater than 320 °C for more than 20 seconds.
No more than three seconds should be required for the attachment.
Sn62/Pb36/Ag2 Solder is also acceptable for use.
Electrically Conductive Epoxy
Die Attachment
Assembly should be preheated to 125-150 °C. A Controlled
amount of Electrically Conductive Epoxy should be used,
approximately 1 to 2 mils thickness for Best Electrical and
Thermal Conductivity. A thin epoxy fillet should be visible
around the perimeter of the chip after placement. Cure epoxy
per manufacturer’s time-temperature schedule.
Assembly Considerations
The following precautions should be observed for successful
assembly of the die.
Cleanliness
These chips should be handled in a clean environment. Do not
attempt to clean die after installation.
Electro-Static Sensitivity
The MA4SW424B-1 Series PIN Diode Switch is ESD, Class 1
sensitive. The proper ESD handling procedures should be
used.
Wire Bonding
Thermosonic wedge or Ball bonding using 0.003” x 0.00025”
Gold ribbon or 0.001” diameter Gold wire is recommended. A
stage temperature of 150 °C and a force of 18 to 22 grams
should be used. Ultrasonic energy should be adjusted to the
minimum required. RF bonds should be as short as possible
for lowest parasitics. One mil diameter Gold Wire results in
approximately 0.02 nH / mil Length.
MA4SW424B-1 Topology
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MA4VAT904-1061T | High IIP3 PIN Diode Variable Attenuator (0.80-1.0 GHz) |
| MA505 | ECM Surface Mount Crystal |
| MA838 | SINGLE PHASE PULSE WIDTH MODULATION WAVEFORM GENERATOR |
| MAADSS0010 | Digital Attenuator, 5-Bit, 31 dB (400 - 2500 MHz) |
| MAAL-007673 | Low Noise Amplifier 1.7 - 2.0 GHz |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MA4SW510 | 制造商:M/A-COM Technology Solutions 功能描述:PIN SWIT 25V - Bulk 制造商:M/A-COM Technology Solutions 功能描述:RF AND MICROWAVE SWITCH 制造商:M/A-COM Technology Solutions 功能描述:Diode PIN Switch 25V |
| MA4SW510B-1 | 功能描述:RF 開關(guān) IC RoHS:否 制造商:M/A-COM Technology Solutions 開關(guān)數(shù)量:Single 開關(guān)配置:SPDT 介入損耗:0.6 dB 截止隔離（典型值）:43 dB 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN-16 封裝:Reel |
| MA4SW610B-1 | 功能描述:RF 開關(guān) IC 2-18GHz ISO 35dB IL 1.9dB @ 18GHz RoHS:否 制造商:M/A-COM Technology Solutions 開關(guān)數(shù)量:Single 開關(guān)配置:SPDT 介入損耗:0.6 dB 截止隔離（典型值）:43 dB 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN-16 封裝:Reel |
| MA4TD0410 | 制造商:MPLUSE 制造商全稱:MPLUSE 功能描述:Silicon Bipolar MMIC Cascadable Amplifier |
| MA4TD0410T | 制造商:MPLUSE 制造商全稱:MPLUSE 功能描述:Silicon Bipolar MMIC Cascadable Amplifier |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。