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參數(shù)資料
| 型號： | MA4SPS502 |
| 英文描述： | Surface Mount Monolithic PIN Diode Chip |
| 中文描述： | 表面貼裝芯片單片PIN二極管 |
| 文件頁數(shù)： | 1/3頁 |
| 文件大?。?/td> | 126K |
| 代理商： | MA4SPS502 |
Features
I
Surface Mount Device
I
No Wirebonds Required
I
Rugged Silicon-Glass Construction
I
Silicon Nitride Passivation
I
Polymer Scratch Protection
I
Low Parasitic Capacitance and Inductance
I
High Power Handling (Efficient Heatsinking)
Description
This device is a silicon-glass PIN diode chip fabricated with
M/A-COM’s patented HMIC
process. This device features
two silicon pedestals embedded in a low loss glass. The diode
is formed on the top of one pedestal and connections to the
backside of the device are facilitated by making the pedestal
sidewalls conductive. Selective backside metalization is
applied producing a surface mount device. The topside is fully
encapsulated with silicon nitride and has an additional polymer
layer for scratch protection. These protective coatings prevent
damage to the junction and the anode air-bridge during
handling and assembly.
Applications
These packageless devices are suitable for usage in moderate
incident power (10 W C.W.) or higher incident peak power
(500 W) series, shunt, or series-shunt switches. Small parasitic
inductance, 0.35 nH, and excellent RC time constant, 0.22 pS,
make the devices ideal for wireless TR switch and accessory
switch circuits, where higher P
1dB
and IP
3
values are required.
These diodes can also be used in
π
, T, tapered resistance, and
switched-pad attenuator control circuits for 50
or 75
systems.
Surface Mount Monolithic
PIN Diode Chip
M
Case Style ODS-1270
1,2
Parameter
Absolute Maximum
Reverse Voltage
-300 V
Forward Current
600 mA
Operating Temperature
-65 °C to +150 °C
Storage Temperature
-65 °C to +150 °C
Dissipated Power (RF & DC)
2 W
Mounting Temperature
+235 °C for 10 seconds
Absolute Maximum Ratings
1
@ T
A
= +25°C (unless otherwise specified)
1. Exceeding these limits may cause permanent damage.
1. Backside metal: 0.1 micron thk. gold.
2. Hatched areas indicate bond pads.
Dim
Inches
Millimeters
Min.
0.056
0.022
0.004
0.020
0.013
Max.
0.058
0.024
0.008
0.022
0.015
Min.
1.435
0.555
0.102
0.505
0.325
Max.
1.485
0.605
0.203
0.555
0.375
A
B
C
D
E
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MA4SPS502_1 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNT PIN Diode |
| MA4SPS502-T | 制造商:M/A-COM Technology Solutions 功能描述:SURMOUNT PIN DIODE - LOW RC PRODUCT - Tape and Reel |
| MA4SPS552 | 制造商:M/A-COM Technology Solutions 功能描述:SURFACE MOUNT MONOLITHIC PIN DIODE CHIP - Gel-pak, waffle pack, wafer, diced wafer on film 制造商:M/A-COM Technology Solutions 功能描述:Diode PIN Attenuator/Switch 200V Die |
| MA4SPS552-T | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM PIN Diode |
| MA4SPS552-W | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM PIN Diode |
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