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參數(shù)資料
Designed for Automated Assembly
These SMQ PIN diodes are designed for high volume tape
and reel assembly. The rectangular package design provides
for highly efficient automatic pick and place assembly
techniques. The parallel flat surfaces are suitable for key
jaw or vacuum pickup techniques. All solder able surfaces
are tin plated and compatible with reflow and vapor phase
soldering methods
.
Enviornmental Capability
HIPAX devices are applicable for use in industrial and
military applications and can be screened to meet the
environmental
requirements
of
MIL-STD-750,
MIL-STD-202 as well as other military standards. The table
below lists some of the MIL-STD 750 tests the device is
designed to meet.
Non Magnetic SMQ HIPAX
PIN Diode
MA4P7441F
-1091T
V 1.00
Features
n
Non-Magnetic Package Suitable for MRI Applications
n
Rectangular MELF SMQ Ceramic Package
n
Hermetically Sealed
n
Lower Rs for Lower Series Loss
n
Longer
τ
L for Lower Intermodulation Distortion
n
Lower Cj for Higher Series Isolation
n
Higher Average Incident Power Handling Capability
Description
The MA4P7441F-1091T is a surface mountable PIN diode
in a Non-Magnetic ( patent pending ) Metal Electrode
Leadless Faced (MELF) package. The device incorporates
M/A-COM’s proven HIPAX technology to produce a low
inductance ceramic package with no ribbons or whisker
wires.
The
package
utilizes
M/A-COM’s
new
non- magnetic plating process to provide an extremely low
permeability, hermetically sealed package. Incorporated in
the package is a passivated PIN diode that is full face
bonded on both the cathode and anode of the chip to
maximize surface area for lower electrical and thermal
resistance.
The
MA4P7441F-1091T
has
been
comprehensively
characterized
both
electrically
and
mechanically
to
ensure
repeatable
and
predictable
performance.
This
MA4P7441F-1091T
Non-Magnetic
device
is
similar
in
electrical
performance
to
the
MA4P4001F-1091T Magnetic part number.
Applications
The diodes are well suited for use in low loss, low
distortion, and high power switching circuits applicable for
high magnetic field environments from HF through UHF
frequencies. The lower thermal resistance of this device
provides excellent higher average performance at RF power
incident levels up to 200 watts CW. This device is designed
to meet the most rigorous electrical and mechanical
requirements of MRI testing environments.
Test
Method
Description
High Temperature Storage
1031
+150 °C, for 340 Hours
Temperature Shock
1051
-65 °C to +125 °C, 20 Cycles
HTRB
1038
80% of rated VB, +150 °C, for 96 Hours
Moisture Resistance
1021
No Initial Conditioning, 85 % RH, +85° C
Gross Leak
1071 Cond. E
Dye Penetrant Visual
Vibration Fatigue
2046
20,000 G’s, 60 Hz, x, y, z axis
Solderability
2026
Test Temperature = +245 °C
MIL-STD-750
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MA4P7441F-1091T_2 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:Non Magnetic SMQ MELF PIN Diode |
| MA4P7446F-1091T | 功能描述:PIN 二極管 RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向電壓:200 V 正向連續(xù)電流: 頻率范圍:10 MHz to 6 GHz 端接類型:SMD/SMT 封裝 / 箱體:QFN-3 封裝:Reel |
| MA4P7446F-1091T_2 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:Non Magnetic SMQ MELF PIN Diode |
| MA4P7447-1141T | 功能描述:PIN 二極管 RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向電壓:200 V 正向連續(xù)電流: 頻率范圍:10 MHz to 6 GHz 端接類型:SMD/SMT 封裝 / 箱體:QFN-3 封裝:Reel |
| MA4P7447-1146T | 功能描述:PIN 二極管 RoHS:否 制造商:Skyworks Solutions, Inc. 配置: 反向電壓:200 V 正向連續(xù)電流: 頻率范圍:10 MHz to 6 GHz 端接類型:SMD/SMT 封裝 / 箱體:QFN-3 封裝:Reel |
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