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參數(shù)資料
| 型號： | M37643M8-XXXFP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PQFP80 |
| 封裝： | 14 X 20 MM, 0.80 MM PITCH, PLASTIC, QFP-80 |
| 文件頁數(shù)： | 6/7頁 |
| 文件大?。?/td> | 1288K |
| 代理商： | M37643M8-XXXFP |
Data Sheet D18461EJ1V0DS
7
2SK4077
TAPE INFORMATION
There are two types (-E1, -E2) of taping depending on the direction of the device.
Reel side
Draw-out side
MARKING INFORMATION
Pb-free plating marking
K4077
Abbreviation of part number
Lot code
RECOMMENDED SOLDERING CONDITIONS
The 2SK4077 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Maximum temperature (Package's surface temperature): 260
°C or below
Time at maximum temperature: 10 seconds or less
Time of temperature higher than 220
°C: 60 seconds or less
Preheating time at 160 to 180
°C: 60 to 120 seconds
Maximum number of reflow processes: 3 times
Maximum chlorine content of rosin flux (percentage mass): 0.2% or less
IR60-00-3
Partial heating
Maximum temperature (Pin temperature): 350
°C or below
Time (per side of the device): 3 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
P350
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