參數資料
型號: M36W832Te85ZA1T
廠商: 意法半導體
英文描述: 32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
中文描述: 32兆位的2Mb x16插槽,引導塊閃存和8兆位的SRAM 512KB的x16,內存產品多
文件頁數: 1/64頁
文件大?。?/td> 897K
代理商: M36W832TE85ZA1T
1/64
May 2003
M36W832TE
M36W832BE
32 Mbit (2Mb x16, Boot Block) Flash Memory
and 8 Mbit (512Kb x16) SRAM, Multiple Memory Product
FEATURES SUMMARY
I
SUPPLY VOLTAGE
– V
DDF
= 2.7V to 3.3V
– V
DDS
= V
DDQF
= 2.7V to 3.3V
– V
PPF
= 12V for Fast Program (optional)
I
ACCESS TIMES: 70ns and 85ns
I
LOW POWER CONSUMPTION
I
ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Top Device Code, M36W832TE: 88BAh
– Bottom Device Code, M36W832BE: 88BBh
FLASH MEMORY
I
32 Mbit (2Mb x16) BOOT BLOCK
– 8 x 4 KWord Parameter Blocks (Top or
Bottom Location)
I
PROGRAMMING TIME
– 10μs typical
– Double Word Programming Option
– Quadruple Word Programming Option
I
BLOCK LOCKING
– All blocks locked at Power up
– Any combination of blocks can be locked
– WPF for Block Lock-Down
I
AUTOMATIC STANDBY MODE
I
PROGRAM and ERASE SUSPEND
I
100,000 PROGRAM/ERASE CYCLES per
BLOCK
I
COMMON FLASH INTERFACE
I
SECURITY
– 128 bit user programmable OTP cells
– 64 bit unique device identifier
Figure 1. Packages
SRAM
I
8 Mbit (512Kb x 16)
I
ACCESS TIME: 70ns
I
LOW V
DDS
DATA RETENTION: 1.5V
I
POWER DOWN FEATURES USING TWO
CHIP ENABLE INPUTS
FBGA
Stacked LFBGA66 (ZA)
12 x 8mm
相關PDF資料
PDF描述
M36W832TEZA 32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
M36W832Be70ZA1S 32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
M36W832Be70ZA1T 32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
M36W832TE-ZAT 32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
M36W832Be70ZA6S 32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
相關代理商/技術參數
參數描述
M36W832TE85ZA6S 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
M36W832TE85ZA6T 功能描述:組合存儲器 32M (2Mx16) 85ns RoHS:否 制造商:Microchip Technology 組織:512 K x 16 電源電壓-最大: 電源電壓-最小: 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:LFBGA-48 封裝:Tray
M36W832TEZA 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
M36W832TE-ZAT 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
M36W864BE-70ZA6 制造商:Micron Technology Inc 功能描述:64M FLASH, 8M SRAM, 3V, BOT, BGA, IND - Trays