參數(shù)資料
型號： M36W832Te70ZA6S
廠商： 意法半導(dǎo)體
英文描述： 32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
中文描述： 32兆位的2Mb x16插槽，引導(dǎo)塊閃存和8兆位的SRAM 512KB的x16，內(nèi)存產(chǎn)品多
文件頁數(shù)： 15/64頁
文件大?。?/td> 897K
代理商： M36W832TE70ZA6S
15/64
M36W832TE, M36W832BE
Flash Command Interface
All Bus Write operations to the memory are inter-
preted by the Command Interface. Commands
consist of one or more sequential Bus Write oper-
ations. An internal Program/Erase Controller han-
dles all timings and verifies the correct execution
of the Program and Erase commands. The Pro-
gram/Erase Controller provides a Status Register
whose output may be read at any time during, to
monitor the progress of the operation, or the Pro-
gram/Erase states. See Table 4, Command
Codes, for a summary of the commands and see
Appendix 31, Table 34, Write State Machine Cur-
rent/Next,
for a summary of the Command Inter-
face.
The Command Interface is reset to Read mode
when power is first applied, when exiting from Re-
set or whenever V
DDF
is lower than V
LKO
. Com-
mand sequences must be followed exactly. Any
invalid combination of commands will reset the de-
vice to Read mode. Refer to Table 3, Flash Com-
mand Codes, in conjunction with the following text
descriptions.
Table 3. Flash Command Codes
Read Memory Array Command.
The
command returns the memory to its Read mode.
One Bus Write cycle is required to issue the Read
Memory Array command and return the memory to
Read mode. Subsequent read operations will read
the addressed location and output the data. When
a device Reset occurs, the memory defaults to
Read mode.
Read Status Register Command.
The
Register indicates when a program or erase oper-
ation is complete and the success or failure of the
operation itself. Issue a Read Status Register
command to read the Status Register’s contents.
Subsequent Bus Read operations read the Status
Register at any address, until another command is
issued. See Table 11, Status Register Bits, for de-
tails on the definitions of the bits.
The Read Status Register command may be is-
sued at any time, even during a Program/Erase
operation. Any Read attempt during a Program/
Erase operation will automatically output the con-
tent of the Status Register.
Read Electronic Signature Command.
The
Read Electronic Signature command reads the
Manufacturer and Device Codes and the Block
Locking Status, or the Protection Register.
The Read Electronic Signature command consists
of one write cycle, a subsequent read will output
the Manufacturer Code, the Device Code, the
Block Lock and Lock-Down Status, or the Protec-
tion and Lock Register. See Tables 5, 6 and 7 for
the valid address.
Read CFI Query Command.
The Read Query
Command is used to read data from the Common
Flash Interface (CFI) Memory Area, allowing pro-
gramming equipment or applications to automati-
cally match their interface to the characteristics of
the device. One Bus Write cycle is required to is-
sue the Read Query Command. Once the com-
mand is issued subsequent Bus Read operations
read from the Common Flash Interface Memory
Area. See Appendix B, Common Flash Interface,
Tables 28, 29, 30, 31, 32 and 33 for details on the
information contained in the Common Flash Inter-
face memory area.
Block Erase Command.
The Block Erase com-
mand can be used to erase a block. It sets all the
bits within the selected block to ’1’. All previous
data in the block is lost. If the block is protected
then the Erase operation will abort, the data in the
block will not be changed and the Status Register
will output the error.
Two Bus Write cycles are required to issue the
command.
I
The first bus cycle sets up the Erase command.
Read
Status
Hex Code
Command
01h
Block Lock confirm
10h
Program
20h
Erase
2Fh
Block Lock-Down confirm
30h
Double Word Program
40h
Program
50h
Clear Status Register
55h
Reserved
56h
Quadruple Word Program
60h
Block Lock, Block Unlock, Block Lock-
Down
70h
Read Status Register
90h
Read Electronic Signature
98h
Read CFI Query
B0h
Program/Erase Suspend
C0h
Protection Register Program
D0h
Program/Erase Resume, Block Unlock
confirm
FFh
Read Memory Array
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M36W832TE70ZA6T 功能描述:閃存 32M (2Mx16) 70ns RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結(jié)構(gòu):256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
M36W832TE85ZA1S 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
M36W832TE85ZA1T 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
M36W832TE85ZA6S 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
M36W832TE85ZA6T 功能描述:組合存儲器 32M (2Mx16) 85ns RoHS:否 制造商:Microchip Technology 組織:512 K x 16 電源電壓-最大: 電源電壓-最小: 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:LFBGA-48 封裝:Tray
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