參數(shù)資料
型號(hào): M36W832Te70ZA1S
廠商: 意法半導(dǎo)體
英文描述: 32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
中文描述: 32兆位的2Mb x16插槽,引導(dǎo)塊閃存和8兆位的SRAM 512KB的x16,內(nèi)存產(chǎn)品多
文件頁數(shù): 42/64頁
文件大小: 897K
代理商: M36W832TE70ZA1S
M36W832TE, M36W832BE
42/64
PACKAGE MECHANICAL
Figure 23. Stacked LFBGA66 12x8mm, 8x8 array, 0.8mm pitch, Bottom View Package Outline
Note: Drawing is not to scale.
Table 23. Stacked LFBGA66, 12x8mm, 8x8 ball array, 0.8mm pitch, Package Mechanical Data
millimeters
Symbol
inches
Typ
Min
Max
Typ
Min
Max
A
1.400
0.0551
A1
0.300
0.0118
A2
1.100
0.0433
b
0.400
0.300
0.500
0.0157
0.0118
0.0197
D
12.000
0.4724
D1
5.600
0.2205
D2
8.800
0.3465
ddd
0.100
0.0039
E
8.000
0.3150
E1
5.600
0.2205
e
0.800
0.0315
FD
1.600
0.0630
FE
1.200
0.0472
SD
0.400
0.0157
SE
0.400
0.0157
A2
A1
A
BGA-Z12
ddd
D
E
e
b
SE
FD
FE
E1
e
D1
SD
D2
BALL "A1"
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M36W832TE70ZA1T 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
M36W832TE70ZA6S 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
M36W832TE70ZA6T 功能描述:閃存 32M (2Mx16) 70ns RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲(chǔ)類型:Flash 存儲(chǔ)容量:2 MB 結(jié)構(gòu):256 K x 8 定時(shí)類型: 接口類型:SPI 訪問時(shí)間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
M36W832TE85ZA1S 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product
M36W832TE85ZA1T 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:32 Mbit 2Mb x16, Boot Block Flash Memory and 8 Mbit 512Kb x16 SRAM, Multiple Memory Product