參數(shù)資料
型號(hào): M36W0R6030B0ZAQ
廠商: 意法半導(dǎo)體
英文描述: 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
中文描述: 64兆位(4Mb的x16插槽,多銀行,突發(fā))閃存和8兆位(512KB的× 16)的SRAM,多芯片封裝
文件頁數(shù): 17/26頁
文件大小: 168K
代理商: M36W0R6030B0ZAQ
17/26
M36W0R6030T0, M36W0R6030B0
Table 9. Read AC Characteristics
Note: 1. Sampled only. Not 100% tested.
2. Whatever the temperature and voltage, t
E1HDZ
and t
E2LDZ
are less than t
E1LDX
and t
E2HDX
; t
BHDZ
is less than t
BLDX
and, t
GHDZ
is
less than t
GHDX
.
Symbol
Alt
Parameter
M36W0R6030T0, M36W0R6030B0
Unit
Min
Max
t
AVAV
t
E1LE1H
t
E2HE2L
t
RC
Read Cycle Time
70
ns
t
AVQV
t
AA
Address Valid to Output Valid
70
ns
t
AVQX
t
OHA
Address Transition to Output Transition
10
ns
t
BHQZ(2)
t
HZBE
Byte Enable High to Data Hi-Z
25
ns
t
BLQV
t
DBE
Byte Enable Low to Data Valid
70
ns
t
BLQX(2)
t
LZBE
Byte Enable Low to Data Transition
5
ns
t
E1HQZ
t
E2LQZ
t
HZCE
Chip Enable 1 High or Chip Enable 2 Low to Data
Hi-Z
25
ns
t
E1LQV
t
E2HQV
t
ACE
Chip Enable 1 Low or Chip Enable 2 High to Data
Valid
70
ns
t
E1LQX
t
E2HQX
t
LZCE
Chip Enable 1 Low or Chip Enable 2 High to Data
Transition
10
ns
t
GHQZ
t
HZOE
Output Enable High to Data Hi-Z
25
ns
t
GLQV
t
DOE
Output Enable Low to Data Valid
35
ns
t
GLQX
t
LZOE
Output Enable Low to Data Transition
5
ns
t
PD(1)
Chip Enable 1 High or Chip Enable 2 Low to
Power Down
70
ns
t
PU(1)
Chip Enable 1 Low or Chip Enable 2 High to
Power Up
0
ns
相關(guān)PDF資料
PDF描述
M36W0R6030B0ZAQE 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
M36W0R6030B0ZAQF 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
M36W0R6030B0ZAQT 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
M36W0R6030T0 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
M36W0R6030T0ZAQ 64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M36W0R6030B0ZAQE 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
M36W0R6030B0ZAQF 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
M36W0R6030B0ZAQT 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
M36W0R6030T0 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory and 8 Mbit (512Kb x16) SRAM, Multi-Chip Package
M36W0R6030T0ZAQ 制造商:Micron Technology Inc 功能描述: