參數(shù)資料
型號(hào)： M306NKME-XXXGP
元件分類(lèi)： 微控制器/微處理器
英文描述： 16-BIT, MROM, 24 MHz, MICROCONTROLLER, PQFP100
封裝： 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100
文件頁(yè)數(shù)： 61/86頁(yè)
文件大?。?/td> 724K
代理商： M306NKME-XXXGP
Rev.2.10
Aug 25, 2006
page 62 of 81
REJ03B0058-0210
M16C/6N Group (M16C/6NK, M16C/6NM)
5. Electric Characteristics (Normal-ver.)
Under development
This document is under development and its contents are subject to change.
4
(NOTE 1)
4
(NOTE 1)
0
4
(NOTE 2)
(NOTE 1)
–4
(NOTE 3)
(NOTE 4)
0
td(BCLK-AD)
th(BCLK-AD)
th(RD-AD)
th(WR-AD)
td(BCLK-CS)
th(BCLK-CS)
th(RD-CS)
th(WR-CS)
td(BCLK-RD)
th(BCLK-RD)
td(BCLK-WR)
th(BCLK-WR)
td(BCLK-DB)
th(BCLK-DB)
td(DB-WR)
th(WR-DB)
td(BCLK-HLDA)
td(BCLK-ALE)
th(BCLK-ALE)
td(AD-ALE)
th(ALE-AD)
td(AD-RD)
td(AD-WR)
tdZ(RD-AD)
ns
Address output delay time
Address output hold time (in relation to BCLK)
Address output hold time (in relation to RD)
Address output hold time (in relation to WR)
Chip select output delay time
Chip select output hold time (in relation to BCLK)
Chip select output hold time (in relation to RD)
Chip select output hold time (in relation to WR)
RD signal output delay time
RD signal output hold time
WR signal output delay time
WR signal output hold time
Data output delay time (in relation to BCLK)
Data output hold time (in relation to BCLK)
Data output delay time (in relation to WR)
Data output hold time (in relation to WR)
__________
HLDA output delay time
ALE signal output delay time (in relation to BCLK)
ALE signal output hold time (in relation to BCLK)
ALE signal output delay time (in relation to Address)
ALE signal output hold time (rin relation to Address)
RD signal output delay from the end of Address
WR signal output delay from the end of Address
Address output floating start time
Symbol
Parameter
Min.
Standard
Unit
Max.
Switching Characteristics
(Referenced to VCC = 3.3 V, VSS = 0 V, at Topr = –40 to 85 °C unless otherwise specified)
Table 5.45 Memory Expansion Mode and Microprocessor Mode
(for 2- to 3-wait setting, external area access and multiplexed bus selection)
50
40
50
40
25
8
Measuring
Condition
Figure 5.11
NOTES:
1. Calculated according to the BCLK frequency as follows:
0.5
109
f(BCLK)
– 10 [ns]
2. Calculated according to the BCLK frequency as follows:
(n –0.5)
109
f(BCLK)
– 50 [ns]
n is “2” for 2-wait setting, “3” for 3-wait setting.
3. Calculated according to the BCLK frequency as follows:
0.5
109
f(BCLK)
– 40 [ns]
4. Calculated according to the BCLK frequency as follows:
0.5
109
f(BCLK)
– 15 [ns]
VCC = 3.3 V
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M306NKMG-XXXGP 制造商:RENESAS 制造商全稱(chēng):Renesas Technology Corp 功能描述:Renesas MCU
M306NKT-EPB 功能描述:EMULATOR PROBE M16C/6N RoHS:否 類(lèi)別:編程器，開(kāi)發(fā)系統(tǒng) >> 配件 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program RoHS指令信息:IButton RoHS Compliance Plan 標(biāo)準(zhǔn)包裝:1 系列:- 附件類(lèi)型:USB 至 1-Wire? RJ11 適配器 適用于相關(guān)產(chǎn)品:1-Wire? 設(shè)備 產(chǎn)品目錄頁(yè)面:1429 (CN2011-ZH PDF)
M306NLFHGP 制造商:Renesas Electronics Corporation 功能描述:
M306NLFHGP#D3 功能描述:IC M16C MCU FLASH 384K 100LQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:M16C™ M16C/60/6NL 標(biāo)準(zhǔn)包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN，SCI，SPI 外圍設(shè)備:POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):21 程序存儲(chǔ)器容量:40KB（20K x 16） 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 6x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤(pán) 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323
M306NLFHGP#U3 功能描述:IC M16C MCU FLASH 384K 100LQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:M16C™ M16C/60/6NL 標(biāo)準(zhǔn)包裝:96 系列:PIC® 16F 核心處理器:PIC 芯體尺寸:8-位 速度:20MHz 連通性:I²C，SPI 外圍設(shè)備:欠壓檢測(cè)/復(fù)位，POR，PWM，WDT 輸入/輸出數(shù):11 程序存儲(chǔ)器容量:3.5KB（2K x 14） 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:- RAM 容量:128 x 8 電壓 - 電源 (Vcc/Vdd):2.3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 8x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:14-TSSOP（0.173"，4.40mm 寬） 包裝:管件
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