2-68 Revision 13 Timing Characteristics Table 2-95 A3PE600 Global Resource
參數(shù)資料
型號: M1A3PE3000-2FG324
廠商: Microsemi SoC
文件頁數(shù): 144/162頁
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 3M 324-FBGA
標準包裝: 84
系列: ProASIC3E
RAM 位總計: 516096
輸入/輸出數(shù): 221
門數(shù): 3000000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 324-BGA
供應(yīng)商設(shè)備封裝: 324-FBGA(19x19)
ProASIC3E DC and Switching Characteristics
2-68
Revision 13
Timing Characteristics
Table 2-95 A3PE600 Global Resource
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
Min.1 Max.2 Min.1 Max.2 Min.1 Max.2
tRCKL
Input Low Delay for Global Clock
0.83
1.04
0.94
1.18
1.11
1.39
ns
tRCKH
Input High Delay for Global Clock
0.81
1.06
0.93
1.21
1.09
1.42
ns
tRCKMPWH Minimum Pulse Width High for Global Clock
0.75
0.85
1.00
ns
tRCKMPWL
Minimum Pulse Width Low for Global Clock
0.85
0.96
1.13
ns
tRCKSW
Maximum Skew for Global Clock
0.25
0.28
0.33
ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
loaded row (all available flip-flops are connected to the global net in the row).
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.
Table 2-96 A3PE1500 Global Resource
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
Min.1 Max.2 Min.1 Max.2 Min.1 Max.2
tRCKL
Input Low Delay for Global Clock
1.071.291.221.471.431.72
ns
tRCKH
Input High Delay for Global Clock
1.061.321.211.501.421.76
ns
tRCKMPWH Minimum Pulse Width High for Global Clock
0.75
0.85
1.00
ns
tRCKMPWL
Minimum Pulse Width Low for Global Clock
0.85
0.96
1.13
ns
tRCKSW
Maximum Skew for Global Clock
0.26
0.29
0.34
ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
loaded row (all available flip-flops are connected to the global net in the row).
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.
Table 2-97 A3PE3000 Global Resource
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter
Description
–2
–1
Std.
Units
Min.1 Max.2 Min.1 Max.2 Min.1 Max.2
tRCKL
Input Low Delay for Global Clock
1.411.621.601.851.882.17
ns
tRCKH
Input High Delay for Global Clock
1.401.661.591.891.872.22
ns
tRCKMPWH Minimum Pulse Width High for Global Clock
0.75
0.85
1.00
ns
tRCKMPWL
Minimum Pulse Width Low for Global Clock
0.85
0.96
1.13
ns
tRCKSW
Maximum Skew for Global Clock
0.26
0.29
0.35
ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
loaded row (all available flip-flops are connected to the global net in the row).
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-5 for derating values.
相關(guān)PDF資料
PDF描述
GMC70DRSN-S273 CONN EDGECARD 140PS DIP .100 SLD
A3PE3000-2FGG324 IC FPGA 1KB FLASH 3M 324-FBGA
A3PE3000-2FG324 IC FPGA 1KB FLASH 3M 324-FBGA
M1A3PE3000-2FGG324 IC FPGA 1KB FLASH 3M 324-FBGA
GSC70DRSN-S273 CONN EDGECARD 140PS DIP .100 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M1A3PE3000-2FG324I 功能描述:IC FPGA 1KB FLASH 3M 324-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3E 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
M1A3PE3000-2FG484 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3E 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
M1A3PE3000-2FG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3E 標準包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:129024 輸入/輸出數(shù):248 門數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP,帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP(75x75)
M1A3PE3000-2FG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3E 產(chǎn)品培訓模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標準包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
M1A3PE3000-2FG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs