1-6 Revision 13 Pro I/Os with Advanced I/O Standards The ProASIC3E family of FPGAs features a flexible I/O" />
參數(shù)資料
型號: M1A3PE1500-1FGG676
廠商: Microsemi SoC
文件頁數(shù): 24/162頁
文件大小: 0K
描述: IC FPGA 1KB FLASH 1.5M 676-FBGA
標(biāo)準(zhǔn)包裝: 40
系列: ProASIC3E
RAM 位總計: 276480
輸入/輸出數(shù): 444
門數(shù): 1500000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 676-BGA
供應(yīng)商設(shè)備封裝: 676-FBGA(27x27)
ProASIC3E Device Family Overview
1-6
Revision 13
Pro I/Os with Advanced I/O Standards
The ProASIC3E family of FPGAs features a flexible I/O structure, supporting a range of voltages (1.5 V,
1.8 V, 2.5 V, and 3.3 V). ProASIC3E FPGAs support 19 different I/O standards, including single-ended,
differential, and voltage-referenced. The I/Os are organized into banks, with eight banks per device (two
per side). The configuration of these banks determines the I/O standards supported. Each I/O bank is
subdivided into VREF minibanks, which are used by voltage-referenced I/Os. VREF minibanks contain 8
to 18 I/Os. All the I/Os in a given minibank share a common VREF line. Therefore, if any I/O in a given
VREF minibank is configured as a VREF pin, the remaining I/Os in that minibank will be able to use that
reference voltage.
Each I/O module contains several input, output, and enable registers. These registers allow the
implementation of the following:
Single-Data-Rate applications (e.g., PCI 66 MHz, bidirectional SSTL 2 and 3, Class I and II)
Double-Data-Rate applications (e.g., DDR LVDS, B-LVDS, and M-LVDS I/Os for point-to-point
communications, and DDR 200 MHz SRAM using bidirectional HSTL Class II)
ProASIC3E banks support M-LVDS with 20 multi-drop points.
Hot-swap (also called hot-plug, or hot-insertion) is the operation of hot-insertion or hot-removal of a card
in a powered-up system.
Cold-sparing (also called cold-swap) refers to the ability of a device to leave system data undisturbed
when the system is powered up, while the component itself is powered down, or when power supplies
are floating.
Specifying I/O States During Programming
You can modify the I/O states during programming in FlashPro. In FlashPro, this feature is supported for
PDB files generated from Designer v8.5 or greater. See the FlashPro User’s Guide for more information.
Note: PDB files generated from Designer v8.1 to Designer v8.4 (including all service packs) have
limited display of Pin Numbers only.
1. Load a PDB from the FlashPro GUI. You must have a PDB loaded to modify the I/O states during
programming.
2. From the FlashPro GUI, click PDB Configuration. A FlashPoint – Programming File Generator
window appears.
3. Click the Specify I/O States During Programming button to display the Specify I/O States During
Programming dialog box.
4. Sort the pins as desired by clicking any of the column headers to sort the entries by that header.
Select the I/Os you wish to modify (Figure 1-3 on page 1-7).
5. Set the I/O Output State. You can set Basic I/O settings if you want to use the default I/O settings
for your pins, or use Custom I/O settings to customize the settings for each pin. Basic I/O state
settings:
1 – I/O is set to drive out logic High
0 – I/O is set to drive out logic Low
Last Known State – I/O is set to the last value that was driven out prior to entering the
programming mode, and then held at that value during programming
Z -Tri-State: I/O is tristated
相關(guān)PDF資料
PDF描述
AMC25DRYH-S734 CONN EDGECARD 50POS DIP .100 SLD
M7A3P1000-2FGG484I IC FPGA 1KB FLASH 1M 484-FBGA
HSC50DRYN-S13 CONN EDGECARD 100PS .100 EXTEND
M7A3P1000-2FG484I IC FPGA 1KB FLASH 1M 484-FBGA
EP4CE55F29C8L IC CYCLONE IV FPGA 55K 780FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M1A3PE1500-1FGG676I 功能描述:IC FPGA 1KB FLASH 1.5M 676-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3E 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計:6635520 輸入/輸出數(shù):270 門數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
M1A3PE1500-1FGG896 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
M1A3PE1500-1FGG896ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
M1A3PE1500-1FGG896I 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
M1A3PE1500-1FGG896PP 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs