ARM CortexTM-M1 Prod uct Br ief 3 " />
參數(shù)資料
型號(hào)： M1A3P1000L-1PQG208I
廠商： Microsemi SoC
文件頁(yè)數(shù)： 6/12頁(yè)
文件大?。?/td> 0K
描述： IC FPGA M1 1KB FLASH 1M 208PQFP
標(biāo)準(zhǔn)包裝： 24
系列： ProASIC3L
RAM 位總計(jì)： 147456
輸入/輸出數(shù)： 154
門數(shù)： 1000000
電源電壓： 1.14V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 85°C
封裝/外殼： 208-BFQFP
供應(yīng)商設(shè)備封裝： 208-PQFP（28x28）
ARM CortexTM-M1
Prod uct Br ief
3
ARM Cortex-M1–Enabled FPGAs
ARM Cortex-M1 is available for use in a growing number
of
Actel
M1
devices.
These
include
M1AFS600,
M1AGL600, M1A3P1000, and a number of additional M1
devices. The devices listed have the features shown in the
following sections:
M1AFS600 Fusion
Actel Fusion Programmable System Chips (PSCs) are the
world’s first mixed-signal FPGAs. Fusion integrates a
12-bit analog-to-digital converter, as many as 40 analog
I/Os, up to 8 Mbits of flash memory, and FPGA fabric all
in a single device. When used in conjunction with a soft
processor such as ARM Cortex-M1, Actel Fusion devices
represent the definitive soft MCU platform.
M1AFS600 Features
Industry’s first mixed-signal FPGA
600,000 system gates – 13,824 logic tiles
ARM Cortex-M1 uses less than 30% of FPGA logic
4 Mbits flash, 108 kbits SRAM
30 analog inputs, 10 analog outputs
172 digital I/Os
2 PLLs, 1% RC oscillator, Xtal oscillator, RTC
M1AGL600 IGLOO FPGAs
The M1 IGLOO devices are reprogrammable, full-
featured flash FPGAs designed to meet the demanding
power and area requirements of today's portable
electronics. Featuring Flash*Freeze technology and
with operating voltages of 1.2 V / 1.5 V, these devices
offer the industry's lowest power consumption. M1
IGLOO
devices
give
designers
a
flexible
system
construction platform for building portable products
that offer maximum battery life.
M1AGL600 Features
Ultra-low power flash-based FPGA
600,000 system gates – 13,824 logic tiles
ARM Cortex-M1 uses less than 33% of FPGA logic
144 kbits SRAM, 235 digital I/Os
M1A3P1000 ProASIC3/E FPGAs
ProASIC3/E devices, the third generation of Actel Flash
FPGAs, offer industry-leading unit cost and lowest total
system cost—up to 504 kbits of SRAM, 350 MHz
operation, and best-in-class logic utilization. These
single-chip FPGAs require no boot ROMs or other
support chips and are highly secure, with 128-bit AES
encryption and FlashLock technology.
M1A3P1000 Features
Low-cost flash-based FPGA
1,000,000 system gates – 24,576 logic tiles
ARM Cortex-M1 uses less than 20% of FPGA logic
144 kbits SRAM
300 digital I/Os
Table 1
ARM Cortex-M1 Utilization Data
Device
Variant
Size (tiles)
RVDS
Size (tiles)
FlashPro
RAM Blocks
Device
Utilization (%)
M1 Fusion
No debug
4,452
–
4
M1AFS600
31
With debug
–
9,272
9,462
4
M1AFS600
68
M1 IGLOO 1.5 V
No debug
4,435
–
4
M1AGL600
31
With debug
–
9,250
9,440
4
M1AGL600
68
M1 IGLOO 1.2 V
No debug
4,435
–
4
M1AGL600
31
With debug
–
9,250
9,440
4
M1AGL600
68
M1 ProASIC3/E
No debug
4,435
–
4
M1A3PE1500
12
With debug
–
9,250
9,440
4
M1A3PE1500
25
Note: Configuration is 0 kbytes ITCM, 0 kbytes DTCM, small multiplier, 1interrupt, no OS extensions, little-endian, and debug as shown.
Refer to the Cortex-M1 Handbook for performance information.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M1A3P1000L-FG144 功能描述:IC FPGA M1 1KB FLASH 1M 144FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3L 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
M1A3P1000L-FG144I 功能描述:IC FPGA M1 1KB FLASH 1M 144FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3L 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27）
M1A3P1000L-FG256 功能描述:IC FPGA M1 1KB FLASH 1M 256FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3L 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
M1A3P1000L-FG256I 功能描述:IC FPGA M1 1KB FLASH 1M 256FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3L 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27）
M1A3P1000L-FG484 功能描述:IC FPGA M1 1KB FLASH 1M 484FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3L 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17）
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