LX5503E
P
RODUCTION
D
ATA
S
HEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
W
M
.
C
InGaP HBT 4 – 6GHz Power Amplifier
I N T E G R A T E D P R O D U C T S
Copyright
2000
Rev. 1.0, 2003-02-12
A B S O L U T E M A X I M U M R A T I N G S
DC Supply Voltage, RF off................................................................................6V
Collector Current.........................................................................................500mA
Total Power Dissipation....................................................................................3W
RF Input Power...........................................................................................10dBm
Operation Ambient Temperature .......................................................-40 to +85°C
Storage Temperature..........................................................................-60 to 150°C
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
P A C K A G E P I N O U T
1
4
5
9
10
11
2
3
6
7
8
12
13
14
15 16
LQ P
ACKAGE
(Bottom View)
F U N C T I O N A L P I N D E S C R I P T I O N
Name
Pin #
Description
RF IN
2, 3
RF input for the power amplifier. This pin is DC-shorted to GND but AC-coupled to the transistor base
of the first stage.
VB1
6
Bias current control voltage for the first stage.
VB2
7
Bias current control voltage for the second stage. The VB2 pin can be connected with VB1 into a single
reference voltage (Vref) through an external resistor bridge.
VCC
9
Supply voltage for the Bias reference and control circuits. This pin can be combined with both VC1 and
VC2 pins, resulting in a single supply voltage (referred to as Vc).
RF OUT
10, 11
RF output for the power amplifier. This pin is AC-coupled and does not require a DC-blocking
capacitor.
VC1
15
Power supply for first stage amplifier. The VC1 feedline should be terminated with a 220pF bypass
capacitor as close to the device as possible, followed by a 1μF bypass capacitor at the supply side.
This pin can be combined with VC2 and VCC pins, resulting in a single supply voltage (Vc).
VC2
14
Power supply for second stage amplifier. The VC2 feedline should be terminated with a 220pF bypass
capacitor as close to the device as possible, followed by a 1μF bypass capacitor at the supply side.
This pin can be combined with VC1 and VCC, resulting in a single supply voltage (Vc).
GND
Center
Metal
The center metal base of the MLPQ package provides both DC/RF ground as well as heat sink for the
power amplifier.
P
A
C
K
A
G
E
D
A
T
A