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參數(shù)資料
| 型號： | LX5503LQ |
| 廠商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分類： | 衰減器 |
| 英文描述： | 4-DIGIT LED DRIVER, SERIALLY INTERFACED |
| 中文描述： | 5000 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | 3 X 3 MM, ROHS COMPLIANT, PLASTIC, MLPQ-16 |
| 文件頁數(shù)： | 1/13頁 |
| 文件大?。?/td> | 473K |
| 代理商： | LX5503LQ |
LX5503
P
RODUCTION
D
ATA
S
HEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
W
M
.
C
InGaP HBT 5-6GHz Power Amplifier
I N T E G R A T E D P R O D U C T S
Copyright
2000
Rev. 1.1, 9/16/2002
D E S C R I P T I O N
The LX5503 is a power amplifier
optimized for the FCC Unlicensed
National Information Infrastructure
(U-NII)
band
and
applications in the 5.15-5.85GHz
frequency range. The PA is im-
plemented as a two-stage monolithic
microwave integrated circuit (MMIC)
with active bias and input/output pre-
matching. The device is manufactured
with an InGaP/GaAs Heterojunction
Bipolar Transistor (HBT) IC process
(MOCVD). It operates at a single low
voltage supply of 3.3V with +25dBm
of P1dB and 22dB power gain
between 5.15-5.35GHz and 18dB gain
up to 5.85GHz.
HiperLAN2
For +18dBm OFDM output power
(64QAM, 54Mbps), the PA provides a
very
low
EVM
Magnitude) of 4%, and consumes less
than 200mA total DC current.
The LX5503 is available in a 16-pin
3mmx3mm micro-lead package (MLP).
The compact footprint, low profile, and
excellent thermal capability of the MLP
package makes the LX5503 an ideal
solution for broadband, medium-gain
power amplifier requirements for IEEE
802.11a, and Hiperlan2 portable WLAN
applications.
(Error-Vector
IMPORTANT:
For the most current data, consult
MICROSEMI
’s website:
http://www.microsemi.com
K E Y F E A T U R E S
Advanced InGaP HBT
5.15-5.85GHz Operation
Single-Polarity 3.3V Supply
Low Quiescent Current Icq
~100mA
P1dB ~ +25dBm across
5.15~5.85GHz
Power Gain ~ 22dB at 5.25GHz
& Pout=18dBm
Power Gain ~ 18dB at 5.85GHz
& Pout=18dBm
Total Current < 200mA for
Pout=18dBm
EVM ~ 4% for 64QAM/ 54Mbps
& Pout=18dBm
Excellent Temperature
Performance
Simple Input/Output Match
Minimal External Components
Small Footprint: 3x3mm
Low Profile: 0.9mm
A P P L I C A T I O N S /B E N E F I T S
FCC U-NII Wireless
IEEE 802.11a
HiperLAN2
P R O D U C T H I G H L I G H T
P A C K A G E O R D E R I N F O
T
J
(
°
C)
LQ
Plastic
16-Pin
LX5503-LQ
-40 to 85
Note: Available in Tape & Reel (3K parts per reel).
Append the letter “T” to the part number.
(i.e. LX5503-LQT)
This device is classified as ESD Level 1 in accordance with MIL-
STD-883, Method 3015 (HBM) testing. Appropriate ESD procedures
should be observed when handling this device.
L
X
5
5
0
3
相關PDF資料 |
PDF描述 |
|---|---|
| LX5503 | CAP 560UF 450V ELECT SMQ SNAP |
| LX5503-LQ | InGaP HBT 5-6GHz Power Amplifier |
| LX5506 | InGaP HBT 4.5 - 6GHz Power Amplifier |
| LX5511 | InGaP HBT 2.3 - 2.5 GHz Power Amplifier |
| LX5511LQ | InGaP HBT 2.3 - 2.5 GHz Power Amplifier |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| LX5503-LQ | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:InGaP HBT 5-6GHz Power Amplifier |
| LX5503LQ-TR | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:InGaP HBT 5-6GHz Power Amplifier |
| LX5506 | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:InGaP HBT 4.5 - 6GHz Power Amplifier |
| LX5506B | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:InGaP HBT 4 6GHz Power Amplifier |
| LX5506BLQ | 制造商:Microsemi Corporation 功能描述:RF AMP CHIP SGL PWR AMP 5.85GHZ 16MLPQ - Bulk |
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