- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄369878 > LX3044 GaAs PIN Photo Detectors PDF資料下載
參數(shù)資料
| 型號(hào)： | LX3044 |
| 英文描述： | GaAs PIN Photo Detectors |
| 中文描述： | 砷化鎵PIN光電探測(cè)器 |
| 文件頁(yè)數(shù)： | 1/5頁(yè) |
| 文件大小： | 261K |
| 代理商： | LX3044 |
LX3044 / 45 / 46
P
RODUCTION
D
ATA
S
HEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1
W
M
.
C
10.3 Gbps Coplanar GaAs PIN Photo Diode
I N T E G R A T E D P R O D U C T S
Copyright
2000
Rev. 1.0, 2002-10-29
D E S C R I P T I O N
Microsemi’s GaAs Coplanar PIN
Photo Diode chips are ideal for high
bandwidth 850nm optical networking
applications.
The device family offers superior
noise performance and sensitivity in
single die, 1x4 array die or 1x12 array
die.
The LX304X family of photo diodes
are currently offered in die form
allowing manufacturers the versatility
of custom assembly using either bond
wire or flip chip configurations.
This
device
manufacturers of optical receivers,
transponders,
optical
modules and combination PIN photo
diode – transimpedance amplifier.
is
ideal
for
transmission
IMPORTANT:
For the most current data, consult
MICROSEMI
’s website:
http://www.microsemi.com
K E Y F E A T U R E S
LX3044 Single Die
LX3045, 1x4 Array Die
LX3046, 1x12 Array Die
Coplanar Waveguide , 50ohm
High Responsivity
Low Dark Current
High Bandwidth
Anode/Cathode on Illuminated
Side
125mm Pad pitch
Die Good for Bond Wire or Flip
Chip Applications
A P P L I C A T I O N S
Short Reach Optical Networks
10Gigabit Ethernet, Fibre
Channel
VCSEL Array Receiver
B E N E F I T S
Large Wirebond Contact Pads
Low Contact Resistance
P R O D U C T H I G H L I G H T
Coplanar Design (gnd-signal-gnd) 50 ohm
characteristic impedance
125 um standard pad pitch for ease of test
Large 75um x 75um pad size for ease of
packaging
Wire bond or Flip Chip capability
Single Die
1x4 Die
1x12 Die
P A C K A G E O R D E R I N F O
Die Dimension
1
(μm)
(μm)
Y
450
450
75
450
Pad Dimension
1
(μm)
w
75
75
75
T
J
(
°
C)
Die
Die
Active Area, A
X
v
75
75
75
Pad Pitch, p
1
(μm)
Die Thickness
1
(μm)
LX3044
LX3045
LX3046
450
1200
3200
125
125
125
152
203
203
0 to 70
1. See Package Dimensions (page 4)
Note: Available in Tape & Reel. Append the letter “T” to the part number. (i.e. LX3044T)
L
X
3
0
4
X
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LX3045 | GaAs PIN Photo Detectors |
| LX3046 | GaAs PIN Photo Detectors |
| LX3050 | InGaAs/InP PIN Photo Detectors |
| LX3051 | InGaAs/InP PIN Photo Detectors |
| LX3052 | InGaAs/InP PIN Photo Detectors |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LX3045 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:GaAs PIN Photo Detectors |
| LX3046 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:GaAs PIN Photo Detectors |
| LX3050 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:InGaAs/InP PIN Photo Detectors |
| LX3051 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:InGaAs/InP PIN Photo Detectors |
| LX3052 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:InGaAs/InP PIN Photo Detectors |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。