
LX2206
P
RODUCTION
D
ATA
S
HEET
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
Copyright
2005
Rev. 1.2, 2006-12-22
W
M
.
C
Dual Level Lithium Ion Battery Charger
TM
A B S O L U T E M A X I M U M R A T I N G S
Supply Input Voltage (IN, BAT) ...................................................................... -0.3V to 7V
All other pins ............................................................................................-0.3V to V
SUPPLY
Battery Charging Current .............................................................................................1.1A
Operating Temperature Range.........................................................................-40 to 150
°
C
Maximum Operating Junction Temperature ..............................................................150
°
C
Storage Temperature Range.........................................................................-65
°
C to 150
°
C
Lead Temperature (Soldering 10 seconds).................................................................300
°
C
Package Peak Temp. for Solder Reflow (40 seconds maximum exposure) ...260°C (+0 -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal
.
T H E R M A L D A T A
LD
Plastic Micro Leadframe Package 10-Pin
THERMAL RESISTANCE
-
JUNCTION TO
A
MBIENT
,
θ
JA
49
°
C/W
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JA
).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow.
P A C K A G E P I N O U T
1
2
3
4
5
6
7
8
9
10
IN
CMP
STAT
DCOK
BAT
LCP
HCP
TMP
H/L
Connect
Bottom PAD to
GND
SD
LD
P
ACKAGE
P
INOUT
(Top View)
RoHS / Pb-free 100% matte Tin Lead Finish
F U N C T I O N A L P I N D E S C R I P T I O N
Name
Description
BAT
CMP
Battery – Connect to a single cell Lithium Ion Battery.
Compensation – Connect the series combination of a 1k resistor and a 0.47μF capacitor from CMP to IN.
Power status logic pin and LED driver – This pin is an open drain output that can sink 20mA of current to drive an
external LED. This pin is low impedance to GND when the Input voltage is high enough to charge the Battery.
Ground – Connect to the system ground plane. Use sufficient via copper area to allow for thermal conduction
from the IC to the GND plane.
High Current Programming (and Termination Current Programming) – Connect a resistor to ground to set the
constant current high level. The termination current is set to 1/10 of the High Current Programming Level.
For a value of 19.6K, the High Current is 460mA and the Termination Current is 46mA.
High or Low load select logic input – A logic high selects the constant charge current level set by the HCP pin
resistor and a logic low selects the constant charge current level set by the LCP pin resistor
Input Power – Connect to a wall adapter or a USB power plug.
Low Current Programming – Connect a resistor to ground to set the constant current low level.
For a value of 110K, the Low Current is 92mA.
Shutdown – A logic high places the LX2206 in sleep mode; can also be used for USB suspend.
Charging status logic pin and LED driver – This pin can source or sink 10mA of current to drive an external LED
in either output state. This pin is low (current sinking mode) when the battery is in charging mode and becomes
high (current sourcing mode) when the charge cycle is finished. It becomes a high impedance when the input
power is removed.
Battery Temperature Monitor – This sense pin determines the battery temperature for charging out of
temperature range lockout and is connected to a resistor network as defined in the Applications section. The
TMP pin is grounded if this function is not used.
DCOK
GND
HCP
H/L
IN
LCP
SD
STAT
TMP
P
A
C
K
A
G
E
D
A
T
A