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參數(shù)資料
| 型號： | LTM8052EV#PBF |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | SWITCHING REGULATOR, 1000 kHz SWITCHING FREQ-MAX, PBGA81 |
| 封裝： | 15 X 11.25 MM, 2.82 MM HEIGHT, ROHS COMPLIANT, MO-222, LGA-81 |
| 文件頁數(shù)： | 14/28頁 |
| 文件大?。?/td> | 350K |
| 代理商： | LTM8052EV#PBF |
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LTM8052
21
8052f
Figure 7. Thermal Resistances Among Module Device,
Printed Circuit Board and Environment
8052 F07
MODULE DEVICE
JUNCTION-TO-CASE (TOP)
RESISTANCE
JUNCTION-TO-BOARD RESISTANCE
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
CASE (TOP)-TO-AMBIENT
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
JUNCTION
AMBIENT
CASE (BOTTOM)-TO-BOARD
RESISTANCE
θJB is the junction-to-board thermal resistance where
almost all of the heat flows through the bottom of the
Module regulator and into the board, and is really the
sum of the
θJCbottom and the thermal resistance of the
bottom of the part through the solder joints and through a
portion of the board. The board temperature is measured
a specified distance from the package, using a 2-sided,
2-layer board. This board is described in JESD 51-9.
Giventhesedefinitions,itshouldnowbeapparentthatnone
of these thermal coefficients reflects an actual physical
operating condition of a Module regulator. Thus, none
of them can be individually used to accurately predict the
thermal performance of the product. Likewise, it would
be inappropriate to attempt to use any one coefficient to
correlate to the junction temperature vs load graphs given
in the product’s data sheet. The only appropriate way to
use the coefficients is when running a detailed thermal
analysis, such as FEA, which considers all of the thermal
resistances simultaneously.
A graphical representation of these thermal resistances
is given in Figure 7.
The blue resistances are contained within the Module
device, and the green are outside.
The die temperature of the LTM8052 must be lower than
the maximum rating of 125°C, so care should be taken in
the layout of the circuit to ensure good heat sinking of the
LTM8052. The bulk of the heat flow out of the LTM8052
is through the bottom of the module and the LGA pads
into the printed circuit board. Consequently a poor printed
circuit board design can cause excessive heating, result-
ing in impaired performance or reliability. Please refer to
the PCB Layout section for printed circuit board design
suggestions.
applicaTions inForMaTion
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LTM8052IV#PBF | 功能描述:IC UMODULE CVCC STEP DOWN 81LGA RoHS:是 類別:電源 - 板載 >> DC DC Converters 系列:µModule® 設(shè)計資源:VI-200, VI-J00 Design Guide, Appl Manual 標(biāo)準(zhǔn)包裝:1 系列:* 類型:隔離 輸出數(shù):1 電壓 - 輸入（最?。?55V 電壓 - 輸入（最大）:100V Voltage - Output 1:5.8V Voltage - Output 2:- Voltage - Output 3:- 電流 - 輸出（最大）:* 電源（瓦） - 制造商系列:100W 電壓 - 隔離:* 特點(diǎn):* 安裝類型:通孔 封裝/外殼:9 針半磚 BusMod 尺寸/尺寸:2.36" L x 2.28" W x 1.08" H（59.9mm x 57.9mm x 27.4mm） 包裝:散裝 工作溫度:-25°C ~ 100°C 效率:* 電源（瓦特）- 最大:* |
| LTM8061 | 制造商:LINER 制造商全稱:Linear Technology 功能描述:32V, 2A μModule Li-Ion/ Polymer Battery Charger |
| LTM8061EV-4.1#PBF | 功能描述:IC BATTERY CHARGER 4.1V 77-LGA RoHS:是 類別:集成電路 (IC) >> PMIC - 電池管理 系列:µModule® 其它有關(guān)文件:STC3100 View All Specifications 特色產(chǎn)品:STC3100 - Battery Monitor IC 標(biāo)準(zhǔn)包裝:4,000 系列:- 功能:燃料，電量檢測計/監(jiān)控器 電池化學(xué):鋰離子（Li-Ion） 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應(yīng)商設(shè)備封裝:8-MiniSO 包裝:帶卷 (TR) 其它名稱:497-10526-2 |
| LTM8061EV-4.1PBF | 制造商:LINER 制造商全稱:Linear Technology 功能描述:32V, 2A μModule Li-Ion/ Polymer Battery Charger |
| LTM8061EV-4.2#PBF | 功能描述:IC BATTERY CHARGER 4.2V 77-LGA RoHS:是 類別:集成電路 (IC) >> PMIC - 電池管理 系列:µModule® 其它有關(guān)文件:STC3100 View All Specifications 特色產(chǎn)品:STC3100 - Battery Monitor IC 標(biāo)準(zhǔn)包裝:4,000 系列:- 功能:燃料，電量檢測計/監(jiān)控器 電池化學(xué):鋰離子（Li-Ion） 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應(yīng)商設(shè)備封裝:8-MiniSO 包裝:帶卷 (TR) 其它名稱:497-10526-2 |
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