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參數(shù)資料
| 型號： | LTG6 |
| 廠商： | Linear Technology Corporation |
| 英文描述： | Rail-to-Rail Input and Output, Ultralow 1.9n Root Hz Noise, Low Power Op Amps |
| 中文描述： | 軌到軌輸入和輸出，超低1.9n根赫茲噪聲，低功耗運算放大器 |
| 文件頁數(shù)： | 20/24頁 |
| 文件大?。?/td> | 587K |
| 代理商： | LTG6 |
LT6202/LT6203/LT6204
20
620234fa
PACKAGE DESCRIPTIO
U
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
MSOP (MS8) 0802
0.53
±
0.015
(.021
±
.006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.077)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.13
±
0.076
(.005
±
.003)
0.86
(.034)
REF
0.65
(.0256)
BSC
0
°
– 6
°
TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
1
2
3
4
4.90
±
0.15
(1.93
±
.006)
8
7
6 5
3.00
±
0.102
(.118
±
.004)
(NOTE 3)
3.00
±
0.102
(.118
±
.004)
NOTE 4
0.52
(.206)
REF
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.889
±
0.127
(.035
±
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
±
0.04
(.0165
±
.0015)
TYP
0.65
(.0256)
BSC
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