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參數(shù)資料
| 型號： | LTG6 |
| 廠商： | Linear Technology Corporation |
| 英文描述： | Rail-to-Rail Input and Output, Ultralow 1.9n Root Hz Noise, Low Power Op Amps |
| 中文描述： | 軌到軌輸入和輸出，超低1.9n根赫茲噪聲，低功耗運算放大器 |
| 文件頁數(shù)： | 19/24頁 |
| 文件大小： | 587K |
| 代理商： | LTG6 |
LT6202/LT6203/LT6204
19
620234fa
PACKAGE DESCRIPTIO
U
GN16 (SSOP) 0502
1
2
3
4
5
6
7
8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16 15 14 13
.189 – .196*
(4.801 – 4.978)
12 11 10 9
.016 – .050
(0.406 – 1.270)
.015
±
.004
(0.38
±
0.10)
×
45
°
0
°
– 8
°
TYP
.007 – .0098
(0.178 – 0.249)
.053 – .068
(1.351 – 1.727)
.008 – .012
(0.203 – 0.305)
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 TYP
.0165
±
.0015
.045
±
.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
DD Package
8-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1698)
3.00
±
0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
0.38
±
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
±
0.10
(2 SIDES)
0.75
±
0.05
R = 0.115
TYP
5
2.38
±
0.10
(2 SIDES)
1
4
8
PIN 1
TOP MARK
0.200 REF
0.00 – 0.05
(DD8) DFN 0203
0.28
±
0.05
2.38
±
0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65
±
0.05
(2 SIDES)
2.15
±
0.05
0.50
BSC
0.675
±
0.05
3.5
±
0.05
PACKAGE
OUTLINE
0.28
±
0.05
0.50 BSC
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