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參數(shù)資料
| 型號： | LTC4440ES6 |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | MOSFETs |
| 英文描述： | High Speed, High Voltage High Side Gate Driver |
| 中文描述： | 2.4 A BUF OR INV BASED MOSFET DRIVER, PDSO6 |
| 封裝： | PLASTIC, MO-193, SOT-23, 6 PIN |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 236K |
| 代理商： | LTC4440ES6 |
11
LTC4440
4440i
PACKAGE DESCRIPTIO
N
U
S6 Package
6-Lead Plastic SOT-23
(Reference LTC DWG # 05-08-1636)
MS8E Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1662)
MSOP (MS8E) 0603
0.53
±
0.152
(.021
±
.006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.127
±
0.076
(.005
±
.003)
0.86
(.034)
REF
0.65
(.0256)
BSC
0
°
– 6
°
TYP
DETAIL “A”
DETAIL “A”
GAUGE
PLANE
1
2
3
4
4.90
±
0.152
(.193
±
.006)
8
8
1
BOTTOM VIEW OF
EXPOSED PAD OPTION
7
6 5
3.00
±
0.102
(.118
±
.004)
(NOTE 3)
3.00
±
0.102
(.118
±
.004)
(NOTE 4)
0.52
(.0205)
REF
1.83
±
0.102
(.072
±
.004)
2.06
±
0.102
(.081
±
.004)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
2.083
±
0.102
(.082
±
.004)
2.794
±
0.102
(.110
±
.004)
0.889
±
0.127
(.035
±
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
±
0.038
(.0165
±
.0015)
TYP
0.65
(.0256)
BSC
1.50 – 1.75
(NOTE 4)
2.80 BSC
0.30 – 0.45
6 PLCS (NOTE 3)
DATUM ‘A’
0.09 – 0.20
(NOTE 3)
S6 TSOT-23 0302
2.90 BSC
(NOTE 4)
0.95 BSC
1.90 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.10
0.20 BSC
0.30 – 0.50 REF
PIN ONE ID
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
3.85 MAX
0.62
MAX
0.95
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.4 MIN
2.62 REF
1.22 REF
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
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