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參數(shù)資料
| 型號： | LTC4095EDC#TRM |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 電源管理 |
| 英文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8 |
| 封裝： | 2 X 2 MM, 0.75 MM HEIGHT, PLASTIC, DFN-8 |
| 文件頁數(shù)： | 7/16頁 |
| 文件大?。?/td> | 225K |
| 代理商： | LTC4095EDC#TRM |
LTC4095
15
4095fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
DC Package
8-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1719 Rev )
2.00
±0.10
(4 SIDES)
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40
± 0.10
BOTTOM VIEW—EXPOSED PAD
0.64
± 0.10
(2 SIDES)
0.75
±0.05
R = 0.115
TYP
R = 0.05
TYP
1.37
±0.10
(2 SIDES)
1
4
8
5
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DC8) DFN 0106 REV
0.23
± 0.05
0.45 BSC
0.25
± 0.05
1.37
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.64
±0.05
(2 SIDES)
1.15
±0.05
0.70
±0.05
2.55
±0.05
PACKAGE
OUTLINE
0.45 BSC
PIN 1 NOTCH
R = 0.20 OR
0.25
× 45°
CHAMFER
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