參數(shù)資料
型號(hào): LTC3810IG#TR
廠商: LINEAR TECHNOLOGY CORP
元件分類: 穩(wěn)壓器
英文描述: SWITCHING CONTROLLER, PDSO28
封裝: 5.30 MM, PLASTIC, SSOP-28
文件頁數(shù): 27/36頁
文件大?。?/td> 495K
代理商: LTC3810IG#TR
LTC3810
33
3810fb
Since power dissipation at VIN(MIN) = 36V already exceeds
0.4W, calculate RNDRV(MAX) such that fault timeout is
always enabled:
RNDRV
36V 10V – 3.5V
270
μA
= 83.3k
So, choose RNDRV = 80.6k.
CIN is chosen for an RMS current rating of about 5A at
85°C. The output capacitors are chosen for a low ESR
of 0.018
Ω to minimize output voltage changes due to
inductor ripple current and load steps. The ripple voltage
will be only:
ΔVOUT(RIPPLE) = ΔIL(MAX) ESR = 4A 0.018Ω
= 72mV
However, a 0A to 10A load step will cause an output
change of up to:
ΔVOUT(STEP) = ΔILOAD ESR = 10A 0.018Ω
= 180mV
An optional 10μF ceramic output capacitor is included
to minimize the effect of ESL in the output ripple. The
complete circuit is shown in Figure 19.
PC Board Layout Checklist
When laying out a PC board follow one of two suggested
approaches. The simple PC board layout requires a dedi-
cated ground plane layer. Also, for higher currents, it is
recommended to use a multilayer board to help with heat
sinking power components.
The ground plane layer should not have any traces and
it should be as close as possible to the layer with power
MOSFETs.
Place CIN, COUT, MOSFETs, D1 and inductor all in one
compact area. It may help to have some components
on the bottom side of the board.
Use an immediate via to connect the components to
ground plane including SGND and PGND of LTC3810.
Use several bigger vias for power components.
Use compact plane for switch node (SW) to improve
cooling of the MOSFETs and to keep EMI down.
Use planes for VIN and VOUT to maintain good voltage
ltering and to keep power losses low.
Flood all unused areas on all layers with copper. Flooding
with copper will reduce the temperature rise of power
component. You can connect the copper areas to any
DC net (VIN, VOUT, GND or to any other DC rail in your
system).
When laying out a printed circuit board, without a ground
plane, use the following checklist to ensure proper opera-
tion of the controller.
Segregate the signal and power grounds. All small-
signal components should return to the SGND pin at
one point which is then tied to the PGND pin close to
the source of M2.
Place M2 as close to the controller as possible, keeping
the PGND, BG and SW traces short.
Connect the input capacitor(s) CIN close to the pow-
er MOSFETs. This capacitor carries the MOSFET AC
current.
Keep the high dV/dt SW, BOOST and TG nodes away
from sensitive small-signal nodes.
Connect the INTVCC decoupling capacitor CVCC closely
to the INTVCC and SGND pins.
Connect the top driver boost capacitor CB closely to
the BOOST and SW pins.
Connect the bottom driver decoupling capacitor CDRVCC
closely to the DRVCC and BGRTN pins.
APPLICATIONS INFORMATION
相關(guān)PDF資料
PDF描述
LTC3810EG SWITCHING CONTROLLER, PDSO28
LTC3812EFE-5 1 A SWITCHING CONTROLLER, PDSO16
LTC3812IFE-5#TR 1 A SWITCHING CONTROLLER, PDSO16
LTC3812EFE-5#TR 1 A SWITCHING CONTROLLER, PDSO16
LTC3812IFE-5 1 A SWITCHING CONTROLLER, PDSO16
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