參數(shù)資料
型號: LTC3770
廠商: Linear Technology Corporation
英文描述: Synchronous Controller with Margining, Tracking and PLL
中文描述: 同步控制器裕,跟蹤和PLL
文件頁數(shù): 22/24頁
文件大?。?/td> 302K
代理商: LTC3770
22
LTC3770
3770f
U
PACKAGE DESCRIPTIO
G Package
28-Lead Plastic SSOP (5.3mm)
(Reference LTC DWG # 05-08-1640)
G28 SSOP 0204
0.09 – 0.25
(.0035 – .010)
0
°
– 8
°
0.55 – 0.95
(.022 – .037)
5.00 – 5.60**
(.197 – .221)
7.40 – 8.20
(.291 – .323)
1
2
3
4
5
6
7
8
9 10 11 12
14
13
9.90 – 10.50*
(.390 – .413)
22 21 20 19 18 17 16 15
23
25
26
24
27
28
2.0
(.079)
MAX
0.05
(.002)
MIN
0.65
(.0256)
BSC
0.22 – 0.38
(.009 – .015)
TYP
MILLIMETERS
(INCHES)
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
*
**
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
0.42
±
0.03
0.65 BSC
5.3 – 5.7
7.8 – 8.2
RECOMMENDED SOLDER PAD LAYOUT
1.25
±
0.12
When laying out a printed circuit board, without a ground
plane, use the following checklist to ensure proper opera-
tion of the controller.
Segregate the signal and power grounds. All small
signal components should return to the SGND pin at
one point which is then tied to the PGND pin close to the
source of M2.
Place M2 as close to the controller as possible, keeping
the PGND, BG and SW traces short.
Connect the input capacitor(s) C
IN
close to the power
MOSFETs. This capacitor carries the MOSFET AC
current.
Keep the high dV/dt SW, BOOST and TG nodes away
from sensitive small-signal nodes.
Connect the INTV
CC
decoupling capacitor C
VCC
closely
to the INTV
CC
and PGND pins.
Connect the top driver boost capacitor C
B
closely to the
BOOST and SW pins.
Connect the V
IN
pin decoupling capacitor C
F
closely to
the V
IN
and PGND pins.
APPLICATIU
W
U
U
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