參數(shù)資料
型號: LTC3765IMSE#TRPBF
廠商: LINEAR TECHNOLOGY CORP
元件分類: 電源管理
英文描述: 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO16
封裝: LEAD FREE, PLASTIC, MSOP-16
文件頁數(shù): 15/24頁
文件大?。?/td> 265K
代理商: LTC3765IMSE#TRPBF
LTC3765
22
3765f
duty cycle approaches maximum duty cycle. This allows
for greater input voltage range variation over traditional
forward converters.
Be cautious with component selection when designing
with high duty cycles. Recall that the voltage on the drain
of the primary switch is equal to VIN/(1-D), where D is the
duty cycle. This voltage increases dramatically as the duty
cycleapproaches100%.TheLTC3766limitsthemaximum
duty cycle to 79% in order to reset the transformer core
without excessive voltage stress on the primary switch.
Pulse Transformer
The pulse transformer that connects the LTC3766 PT+/
PT outputs to the LTC3765 IN+/IN inputs functions as the
communicationlinkbetweenthesecondary-sidecontroller
and the primary-side gate driver, as shown in Figure 9.
Refer to the LTC3766 data sheet to determine the turns
ratio and volt-second specifications for the pulse trans-
former. Keep in mind that the amplitude of the signals on
the IN+ and INpins should be in the range of 4V to 15V
to ensure proper operation.
The 1F and 0.1F capacitors in series with the pulse
transformer of Figure 9 are for blocking and restoring the
DC level of the signal. These values are appropriate for
most LTC3765/LTC3766 applications.
Bypassing and Grounding
The LTC3765 requires proper bypassing on the VCCsupply
due to its high speed switching (nanoseconds) and large
AC currents (Amperes). Careless component placement
and PCB trace routing may cause excessive ringing and
undershoot/overshoot.
To obtain the optimal performance from the LTC3765:
A. Use a low inductance, low impedance ground plane
to reduce any ground drop and stray capacitance.
Remember that the LTC3765 switches greater than
2A peak currents and any significant ground drop will
degrade signal integrity.
B. Mount a bypass capacitor as close as possible between
the VCC pin and ground plane.
C. Plan the power/ground routing carefully. Know where
the large load switching current is coming from and
going to. Maintain separate ground return paths for
the signal pins and the output power stage.
D. Keep the copper traces between the driver output pins
and the load short and wide.
E. Solder the exposed pad on the back side of the LTC3765
package to the ground plane. The exposed pad is inter-
nally electrically connected to the SGND pin; however,
rated thermal performance will only be achieved if the
exposed pad is soldered to a low impedance ground
plane.
0.1F
1F
N3765:N3766
IN+
IN
LTC3765
3765 F09
PT+
PT
LTC3766
Figure 9. Pulse Transformer Connection
APPLICATIONS INFORMATION
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