參數(shù)資料
型號: LTC3411
廠商: Linear Technology Corporation
英文描述: 1.25A, 4MHz, Synchronous Step-Down DC/DC Converter
中文描述: 電流1.25A,4MHz,同步降壓型DC / DC轉換器
文件頁數(shù): 19/20頁
文件大?。?/td> 288K
代理商: LTC3411
LTC3411
19
sn3411 3411fs
PACKAGE DESCRIPTIO
U
MS10 Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
MSOP (MS) 0402
0.53
±
0.01
(.021
±
.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
0.13
±
0.05
(.005
±
.002)
0.86
(.034)
REF
0.50
(.0197)
TYP
1 2 3 4 5
4.88
±
0.10
(.192
±
.004)
0.497
±
0.076
(.0196
±
.003)
REF
8
9
10
7 6
3.00
±
0.102
(.118
±
.004)
(NOTE 3)
3.00
±
0.102
(.118
±
.004)
NOTE 4
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
°
– 6
°
TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.889
±
0.127
(.035
±
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305
±
0.038
(.0120
±
.0015)
TYP
0.50
(.0197)
BSC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
DD Package
10-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1699)
3.00
±
0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38
±
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
±
0.10
(2 SIDES)
0.75
±
0.05
R = 0.115
TYP
2.38
±
0.10
(2 SIDES)
1
5
10
6
PIN 1
TOP MARK
(SEE NOTE 5)
0.200 REF
0.00 – 0.05
(DD10) DFN 0403
0.25
±
0.05
2.38
±
0.05
(2 SIDES)
RECOMMENDED
SOLDER PAD PITCH AND DIMENSIONS
1.65
±
0.05
(2 SIDES)
2.15
±
0.05
0.50
BSC
0.675
±
0.05
3.50
±
0.05
PACKAGE
OUTLINE
0.25
±
0.05
0.50 BSC
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相關代理商/技術參數(shù)
參數(shù)描述
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