- 您現(xiàn)在的位置：買賣IC網(wǎng) > Datasheet目錄41 > LTC3100EUD#TRPBF (Linear Technology)IC REG BUCK/BOOST/LINEAR 16-QFN Datasheet資料下載
參數(shù)資料
| 型號： | LTC3100EUD#TRPBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 17/26頁 |
| 文件大?。?/td> | 403K |
| 描述： | IC REG BUCK/BOOST/LINEAR 16-QFN |
| 產(chǎn)品培訓(xùn)模塊： | More Information on LDOs |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 拓?fù)洌?/td> | 降壓（降壓）（1），升壓（升壓）（1），線性（LDO）（1） |
| 功能： | 任何功能 |
| 輸出數(shù)： | 3 |
| 頻率 - 開關(guān)： | 1.5MHz |
| 電壓/電流 - 輸出 1： | 0.6 V ~ 5.5 V，250mA |
| 電壓/電流 - 輸出 2： | 1.5 V ~ 5.25 V，700mA |
| 電壓/電流 - 輸出 3： | 0.6 V ~ 5.25 V，100mA |
| 帶 LED 驅(qū)動(dòng)器： | 無 |
| 帶監(jiān)控器： | 無 |
| 帶序列發(fā)生器： | 是 |
| 電源電壓： | 0.5 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-WFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 16-QFN-EP（3x3） |
| 包裝： | 帶卷 (TR) |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁當(dāng)前第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁
LTC3100
17
3100fb
For more information www.linear.com/LTC3100
PC Board Layout Guidelines
The LTC3100 switches large currents at high frequen-
cies. Special care should be given to the PC board layout
to ensure stable, noise-free operation. You will not get
advertised performance with a careless layout. Figure 1
depicts the recommended PC board layout. A large ground
pin copper area will help to lower the chip temperature.
A multilayer board with a separate ground plane is ideal,
but not absolutely necessary.
A few key guidelines follow:
1. All circulating high current paths should be kept as
short as possible. Capacitor ground connections should
via down to the ground plane in the shortest route
possible. The bypass capacitors on all V
IN
and V
OUT
APPLICATIONS INFORMATION
Figure 1. Recommended Component Placement for Two-Layer PC Board
pins should be placed as close to the IC as possible
and should have the shortest possible paths to ground.
2. To prevent large circulating currents from disrupting the
output voltage sensing, the ground for each resistor
divider should be returned directly to the ground plane
near the IC.
3. Use of vias in the die attach pad of the IC will enhance
the thermal environment of the converter, especially if
the vias extend to a ground plane region on the exposed
bottom surface of the PC board.
4. Keep the connection from the resistor dividers to the
feedback pins as short as possible and away from the
switch pin connections.
16
LTC3100
3100 F01
15 14 13
5 6
8
7
12
11
10
9
1
2
3
4
FBBST
SWBST
V
BST
V
LDO
V
BUCK
SWBK
FBLDO
RUNLDO
FBBK
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LTC3104IMSE#TRPBF | IC REG DL BCK/LINEAR SYNC 16MSOP |
| LTC3445EUF#TRPBF | IC REG TRPL BUCK/LINEAR 24-QFN |
| LTC3446IDE#PBF | IC REG TRPL BCK/LINEAR 14-DFN |
| LTC3537EUD#TRPBF | IC REG DL BST/LINEAR SYNC 16-QFN |
| LTC3541EDD#TRPBF | IC REG DL BCK/LINEAR SYNC 10-DFN |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LTC3101 | 制造商:LINER 制造商全稱:Linear Technology 功能描述:8-Output Regulator with Sequencing and I2C |
| LTC3101_10 | 制造商:LINER 制造商全稱:Linear Technology 功能描述:Wide VIN, Multi-Output DC/DC Converter and PowerPath Controller |
| LTC3101EUF#PBF | 功能描述:IC BUCK/BST TRPL ADJ 350MA 24QFN RoHS:是 類別:集成電路 (IC) >> PMIC - 電源管理 - 專用 系列:PowerPath™ 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:50 系列:- 應(yīng)用:熱電冷卻器 電流 - 電源:- 電源電壓:3 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.173"，4.40mm 寬）裸露焊盤 供應(yīng)商設(shè)備封裝:28-TSSOP 裸露焊盤 包裝:管件 產(chǎn)品目錄頁面:1410 (CN2011-ZH PDF) |
| LTC3101EUF#TRPBF | 功能描述:IC BUCK/BST TRPL ADJ 350MA 24QFN RoHS:是 類別:集成電路 (IC) >> PMIC - 電源管理 - 專用 系列:PowerPath™ 標(biāo)準(zhǔn)包裝:1 系列:- 應(yīng)用:手持/移動(dòng)設(shè)備 電流 - 電源:- 電源電壓:3 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:14-LLP-EP（4x4） 包裝:Digi-Reel® 配用:LP3905SD-30EV-ND - BOARD EVALUATION LP3905SD-30 其它名稱:LP3905SD-30DKR |
| LTC3101EUF-PBF | 制造商:LINER 制造商全稱:Linear Technology 功能描述:Wide VIN, Multi-Output DC/DC Converter and PowerPath Controller |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。