參數(shù)資料
型號: LTC3100EUD#TRPBF
廠商: Linear Technology
文件頁數(shù): 10/26頁
文件大小: 403K
描述: IC REG BUCK/BOOST/LINEAR 16-QFN
產(chǎn)品培訓(xùn)模塊: More Information on LDOs
標(biāo)準(zhǔn)包裝: 2,500
拓?fù)洌?/td> 降壓(降壓)(1),升壓(升壓)(1),線性(LDO)(1)
功能: 任何功能
輸出數(shù): 3
頻率 - 開關(guān): 1.5MHz
電壓/電流 - 輸出 1: 0.6 V ~ 5.5 V,250mA
電壓/電流 - 輸出 2: 1.5 V ~ 5.25 V,700mA
電壓/電流 - 輸出 3: 0.6 V ~ 5.25 V,100mA
帶 LED 驅(qū)動(dòng)器:
帶監(jiān)控器:
帶序列發(fā)生器:
電源電壓: 0.5 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 16-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 16-QFN-EP(3x3)
包裝: 帶卷 (TR)
LTC3100
10
3100fb
For more information www.linear.com/LTC3100
PIN FUNCTIONS
FBLDO (Pin 11): Feedback Input to the g
m
 Error Amplifier
for the LDO Regulator. Connect the resistor divider tap to
this pin. The output voltage can be adjusted from 0.6V
to 5.25V by:
 
 
V
OUT_LDO
=0.600V" 1+
R4
R3
?/DIV>
?/DIV>
?/DIV>
?/DIV>
?/DIV>
?/DIV>
FBBST (Pin 12): Feedback Input to the g
m
 Error Amplifier
for the Boost Converter. Connect the resistor divider tap
to this pin. The output voltage can be adjusted from 1.5V
to 5.25V by:
 
 
V
OUT_BOOST
=1.20V" 1+
R2
R1
?/DIV>
?/DIV>
?/DIV>
?/DIV>
?/DIV>
?/DIV>
MODE (Pin 13): Logic-Controlled Mode Select Pin for Both 
the Boost and Buck Converters. There is an internal 1M?
pull-up on this pin to the higher of V
INBST
, V
BST
 or V
INBK
.
MODE = Float or High: Enables Burst Mode operation for
both the boost and the buck.
MODE = Low: Disables Burst Mode operation. Both con-
verters will operate in fixed frequency mode regardless
of load current.
RUNBST (Pin 14): Logic-Controlled Shutdown Input for 
the Boost Converter. There is an internal 4M?pull-down
on this pin.
RUNBST = High: Normal operation
RUNBST = Low: Shutdown
PGBST (Pin 15): Open-Drain Output That Pulls to Ground 
When FBBST Is More Than 8% Below Its Regulated Volt-
age. Connect a pull-up resistor from this pin to a positive
supply less than 6V.
V
INBST
 (Pin 16): Input Voltage for the Boost Converter. 
Connect a minimum of 1礔 ceramic decoupling capacitor
from this pin to ground.
Exposed Pad (Pin 17): The Exposed Pad must be soldered 
to the PCB ground plane. It serves as the power ground
connection, and as a means of conducting heat away
from the die.
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