參數(shù)資料
型號(hào): LTC2360IS6#TRPBF
廠商: Linear Technology
文件頁數(shù): 11/20頁
文件大?。?/td> 0K
描述: IC ADC 12BIT 100KSPS TSOT23-6
標(biāo)準(zhǔn)包裝: 2,500
位數(shù): 12
采樣率(每秒): 100k
數(shù)據(jù)接口: MICROWIRE?,串行,SPI?
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 3.6mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: SOT-23-6 細(xì)型,TSOT-23-6
供應(yīng)商設(shè)備封裝: TSOT-23-6
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 1 個(gè)單端,單極
配用: DC1190A-E-ND - BOARD SAR ADC LTC2360
LTC2360/LTC2361/LTC2362
19
236012fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
S6 Package
6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636)
1.50 – 1.75
(NOTE 4)
2.80 BSC
0.30 – 0.45
6 PLCS (NOTE 3)
DATUM ‘A’
0.09 – 0.20
(NOTE 3)
S6 TSOT-23 0302 REV B
2.90 BSC
(NOTE 4)
0.95 BSC
1.90 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.10
0.20 BSC
0.30 – 0.50 REF
PIN ONE ID
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
3.85 MAX
0.62
MAX
0.95
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.4 MIN
2.62 REF
1.22 REF
TS8 Package
8-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1637)
1.50 – 1.75
(NOTE 4)
2.80 BSC
0.22 – 0.36
8 PLCS (NOTE 3)
DATUM ‘A’
0.09 – 0.20
(NOTE 3)
TS8 TSOT-23 0802
2.90 BSC
(NOTE 4)
0.65 BSC
1.95 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.10
0.20 BSC
0.30 – 0.50 REF
PIN ONE ID
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
3.85 MAX
0.52
MAX
0.65
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.4 MIN
2.62 REF
1.22 REF
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