參數(shù)資料
型號(hào): LTC2351IUH-12
廠商: LINEAR TECHNOLOGY CORP
元件分類: ADC
英文描述: 6-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PQCC32
封裝: 5 X 5 MM, PLASTIC, MO-220WHHD, QFN-32
文件頁數(shù): 11/20頁
文件大?。?/td> 273K
代理商: LTC2351IUH-12
19
LTC2351-12
235112f
U
PACKAGE DESCRIPTIO
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
UH Package
32-Lead Plastic QFN (5mm
× 5mm)
(Reference LTC DWG # 05-08-169)
5.00
± 0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
± 0.10
31
1
2
32
BOTTOM VIEW—EXPOSED PAD
3.50 REF
(4-SIDES)
3.45
± 0.10
3.45
± 0.10
0.75
± 0.05
R = 0.115
TYP
0.25
± 0.05
(UH32) QFN 0406 REV D
0.50 BSC
0.200 REF
0.00 – 0.05
0.70
±0.05
3.50 REF
(4 SIDES)
4.10
±0.05
5.50
±0.05
0.25
± 0.05
PACKAGE OUTLINE
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
PIN 1 NOTCH R = 0.30 TYP
OR 0.35
× 45° CHAMFER
R = 0.05
TYP
3.45
± 0.05
3.45
± 0.05
相關(guān)PDF資料
PDF描述
LTC2351CUH-12#TR 6-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PQCC32
LTC2351CUH-12 6-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PQCC32
LTC2351IUH-12#TR 6-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PQCC32
LTC2355CMSE-12#TR 1-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO10
LTC2355IMSE-12#TR 1-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO10
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