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參數(shù)資料
| 型號： | LTC2217CUP#TR |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | ADC |
| 英文描述： | 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64 |
| 封裝： | 9 X 9 MM, PLASTIC, MO-220WNJR, QFN-64 |
| 文件頁數(shù)： | 25/32頁 |
| 文件大?。?/td> | 1285K |
| 代理商： | LTC2217CUP#TR |
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LTC2217
31
2217f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
UP Package
64-Lead Plastic QFN (9mm × 9mm)
(Reference LTC DWG # 05-08-1705)
9 .00
± 0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
PIN 1 TOP MARK
(SEE NOTE 5)
0.40
± 0.10
64
63
1
2
BOTTOM VIEW—EXPOSED PAD
7.15
± 0.10
7.15
± 0.10
7.50 REF
(4-SIDES)
0.75
± 0.05
R = 0.10
TYP
R = 0.115
TYP
0.25
± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UP64) QFN 0406 REV C
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70
±0.05
7.50 REF
(4 SIDES)
7.15
±0.05
7.15
±0.05
8.10
±0.05 9.50 ±0.05
0.25
±0.05
0.50 BSC
PACKAGE OUTLINE
PIN 1
CHAMFER
C = 0.35
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相關(guān)代理商/技術(shù)參數(shù) |
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| LTC2217CUP-TRPBF | 制造商:LINER 制造商全稱:Linear Technology 功能描述:16-Bit, 105Msps Low Noise ADC |
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| LTC2217IUP#TRPBF | 制造商:Linear Technology 功能描述:IC ADC 16BIT 105MSPS LN 64-QFN |
| LTC2217IUP-PBF | 制造商:LINER 制造商全稱:Linear Technology 功能描述:16-Bit, 105Msps Low Noise ADC |
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