參數(shù)資料
型號: LTC2217CUP#TR
廠商: LINEAR TECHNOLOGY CORP
元件分類: ADC
英文描述: 1-CH 16-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC64
封裝: 9 X 9 MM, PLASTIC, MO-220WNJR, QFN-64
文件頁數(shù): 19/32頁
文件大?。?/td> 1285K
代理商: LTC2217CUP#TR
LTC2217
26
2217f
Grounding and Bypassing
The LTC2217 requires a printed circuit board with a
clean unbroken ground plane; a multilayer board with an
internal ground plane is recommended. The pinout of the
LTC2217 has been optimized for a owthrough layout so
that the interaction between inputs and digital outputs is
minimized. Layout for the printed circuit board should
ensure that digital and analog signal lines are separated
as much as possible. In particular, care should be taken
not to run any digital track alongside an analog signal
track or underneath the ADC.
High quality ceramic bypass capacitors should be used
at the VDD, VCM, and OVDD pins. Bypass capacitors must
be located as close to the pins as possible. The traces
connecting the pins and bypass capacitors must be kept
short and should be made as wide as possible.
The LTC2217 differential inputs should run parallel and
close to each other. The input traces should be as short
as possible to minimize capacitance and to minimize
noise pickup.
Heat Transfer
Most of the heat generated by the LTC2217 is transferred
from the die through the bottom-side exposed pad. For
good electrical and thermal performance, the exposed
pad must be soldered to a large grounded pad on the PC
board. It is critical that the exposed pad and all ground
pins are connected to a ground plane of sufcient area
with as many vias as possible.
APPLICATIONS INFORMATION
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